Improving the accuracy of the transient plane source method by correcting probe heat capacity and resistance influences

Li, Yanning; Shi, Chunfeng; Liu, Jian; Liu, Errui; Jian, Shao; Chen, Zhi; Dorantes-González, Dante Jorge; Hu, Xiaotang

doi:10.1088/0957-0233/25/1/015006

Cited by 32 publications

(20 citation statements)

References 25 publications

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“…a) Top and cross-sectional views of the TPS method [58]. is a constant voltage source, 1 (11) needs to be revised to [62]:…”

Section: Transient Plane Source (Tps) Methodsmentioning

confidence: 99%

“…( ) is a dimensionless theoretical expression of the time dependent increase that describes heat conduction of the sensor. The curve is reconstructed from data published in Ref [57].The TPS method was reported to be capable for measuring materials with thermal conductivity ranging from 0.005 to 500 W/m · K in the temperature range from cryogenic temperatures to 500 K, including liquids, aerogels and solids[59][60][61][62]. ASTM D7984[56] and ISO 22007-2[63] specify the test apparatus and procedure for the TPS method.…”

mentioning

confidence: 99%

“…Model corrections for these errors are necessary to improve measurement accuracy when doing data analysis. Readers can refer to Refs [59,60,62]. for more information.…”

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confidence: 99%

See 2 more Smart Citations

Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials

Zhao

Qian

et al. 2016

Journal of Electronic Packaging

401

222

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Thermal conductivity and interfacial thermal conductance play crucial roles in the design of engineering systems where temperature and thermal stress are of concerns. To date, a variety of measurement techniques are available for both bulk and thin film solid-state materials with a broad temperature range. For thermal characterization of bulk material, the steady-state method, transient hot-wire method, laser flash diffusivity method, and transient plane source method are most used.For thin film measurement, the 3ω method and the transient thermoreflectance technique including both time-domain and frequency-domain analysis are widely employed. This work reviews several most commonly used measurement techniques. In general, it is a very challenging task to determine thermal conductivity and interfacial thermal conductance with less than 5% error.Selecting a specific measurement technique to characterize thermal properties needs to be based on: 1) knowledge on the sample whose thermophysical properties is to be determined, including the sample geometry and size, and the material preparation method; 2) understanding of fundamentals and procedures of the testing technique, for example, some techniques are limited to samples with specific geometries and some are limited to a specific range of thermophysical properties; 3) understanding of the potential error sources which might affect the final results, for example, the convection and radiation heat losses.

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“…a) Top and cross-sectional views of the TPS method [58]. is a constant voltage source, 1 (11) needs to be revised to [62]:…”

Section: Transient Plane Source (Tps) Methodsmentioning

confidence: 99%

mentioning

confidence: 99%

See 1 more Smart Citation

Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials

Zhao

Qian

et al. 2016

Journal of Electronic Packaging

401

222

View full text Add to dashboard Cite

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“…The thermal conductivity of nano-enhanced PCMs can be measured using either steady-state methods or transient-state methods [42]. Guarded hot plate method is a typical example of the steady-state method while transient hot wire method, laser flash method and transient plane source method are among the typical transient-state methods [42,43].…”

Section: Materials Thermal Characterizationmentioning

confidence: 99%

Nano-enhanced phase change materials for improved building performance

Lin

Sohel

2016

Renewable and Sustainable Energy Reviews

168

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Nano-enhanced phase change materials (PCMs) have attracted increasing attention to address one of the key barriers (i.e. low thermal conductivity) to the wide adoption of PCMs in many industrial applications. This paper discusses the generic problem and key issues associated with appropriately using this new class of materials in buildings for effective thermal management and improved energy performance. An overview on major recent development and application of nano-enhanced PCMs as thermal energy storage media is provided. A case study based on a PCM ceiling ventilation system integrated with solar photovoltaic thermal (PVT) collectors is then performed to evaluate the potential benefits due to the dispersion of copper nanoparticles into the PCM base fluid of RT24. The results showed that this nano-enhanced PCM has higher melting and solidification rates than that of the pure PCM. Compared to the use of the pure PCM, 8.3% more heat was charged in and 25.1% more heat was discharged from the nano-enhanced PCM under the three winter test days. More research is needed to understand the fundamental mechanisms behind the PCM thermal conductivity enhancement through the dispersion of nanometer-sized materials and to investigate how these mechanisms drive building performance enhancement. Abstract: Nano-enhanced phase change materials (PCMs) have attracted increasing attention to address one of the key barriers (i.e. low thermal conductivity) to the wide adoption of PCMs in many industrial applications. This paper discusses the generic problem and key issues associated with appropriately using this new class of materials in buildings for effective thermal management and improved energy performance. An overview on major recent development and application of nano-enhanced PCMs as thermal energy storage media is provided. A case study based on a PCM ceiling ventilation system integrated with solar photovoltaic thermal (PVT) collectors is then performed to evaluate the potential benefits due to the dispersion of copper nanoparticles into the PCM base fluid of RT24. The results showed that this nano-enhanced PCM has higher melting and solidification rates than that of the pure PCM. Compared to the use of the pure PCM, 8.3% more heat was charged in and 25.1% more heat was discharged from the nano-enhanced PCM under the three winter test days. More research is needed to understand the fundamental mechanisms behind the PCM thermal conductivity enhancement through the dispersion of nanometer-sized materials and to investigate how these mechanisms drive building performance enhancement.

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“…Previous works on the former aspect focused on the sensitivity of the input parameters and the data fitting procedure based on the original analytical model, but could not explain the overestimation of k in TI materials. [21][22][23][24][25][26] In the latter aspect, several publications investigated the accuracy and performance of commercial TPS devices based on numerical simulations to study the effect of the sensors on the TPS measurement for bulk or thin film 20,[27][28][29][30][31] and the error due to thermal radiation in semitransparent sample. 17,33 However, these researches provide no systematic investigation on the sensor geometric parameters and sample thermal properties.…”

mentioning

confidence: 99%

Analysis and improvement of the hot disk transient plane source method for low thermal conductivity materials

Zheng

Kaur

Dames

et al. 2020

International Journal of Heat and Mass Transfer

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The hot disk transient plane source (TPS) method is a widely used standard technique (ISO 22007-2) for the characterization of thermal properties of materials, especially the thermal conductivity, k. Despite its well-established reliability for a wide variety of common materials, the hot disk TPS method is also known to suffer from a substantial systematic errors when applied to low-k thermal insulation materials, because of the discrepancies between the idealized model used for data analysis and the actual heat transfer process. Here, we present a combined numerical and experimental study on the influence of the geometry of hot disk sensor on measured value of lowk materials. We demonstrate that the error is strongly affected by the finite thickness and thermal mass of the sensor's insulation layer was well as the corresponding increase of the effective heater size beyond the radius of the embedded metal heater itself. We also numerically investigate the dependence of the error on the sample thermal properties, confirming that the errors are worse in low-k samples. A simple correction function is also provided, which converts the apparent (erroneous) result from a standard hot disk TPS measurement to a more accurate value. A standard polyimide sensor was also optimized using both wet and dry etching to provide more accurate measurement directly. Experimentally corrected value of k for Airloy® x56 aerogel and a

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Improving the accuracy of the transient plane source method by correcting probe heat capacity and resistance influences

Cited by 32 publications

References 25 publications

Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials

Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials

Nano-enhanced phase change materials for improved building performance

Analysis and improvement of the hot disk transient plane source method for low thermal conductivity materials

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