“…The rapid advancement of next-generation technology , has led to the development of highly integrated devices such as printed circuit boards (PCBs), micro light-emitting diodes (μLEDs), and automobiles, which are lightweight, miniaturized, and multifunctional. However, the efficient management of heat in these devices has emerged as a critical challenge, particularly in the context of electric vehicles, where severe thermal accumulation poses a significant industry-wide obstacle. , To address the issue of heat dissipation in electronic devices, thermal interface materials (TIM), such as polymer composites, have been developed. Despite the advantages of polymers, including their ease of processing, low cost, and lightweight nature, their inherent thermal conductivity is relatively low, typically less than 0.5 W m –1 K –1 .…”