Improving the dimensional accuracy of computed tomography data obtained with high-resolution 3D X-ray microscopes

Villarraga-Gómez, Herminso; Kotwal, Naomi; Parwani, Rachna; Omlor, Lars; Johnson, Bruce E.; Zarnetta, Robert; Weiss, Daniel J.; Kimmig, Wolfgang; Hagen, Christoph Graf vom

doi:10.58286/26611

Cited by 2 publications

(8 citation statements)

References 16 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Although sub-micrometer resolution laboratory CT systems, often referred to as 3D x-ray microscopes (XRMs), were introduced more than a decade ago [4][5][6][7], these instruments have been used primarily for failure analysis, material science, and process development. Except for some preliminary results previously presented by the authors in conference proceedings [8,9], there are no other reports in the current literature, to the authors' knowledge, reporting precision dimensional metrology applications with XRMs. The main approach for CT dimensional metrology, until now, has been the use of xray projection-based geometries employing flat panel detectors with effective pixel sizes (pixel pitch) ranging from 127 µm to 200 µm [1,[10][11][12].…”

Section: Introductionmentioning

confidence: 87%

“…Spatial resolution limitations can hinder essential surface details that, in addition to improve the accuracy of CT-based dimensional data, could enable other nondestructive analyses, such as morphological characterization of internal walls and evaluation of material porosity, which require high spatial resolution features. As an alternative, this paper proposes the use of sub-micrometer resolution XRM instruments for dimensional metrology, an idea that has not been widely explored until some recent work introduced (by the authors) at conference settings [8,9]. This article builds on that work and introduces new data that verify the dimensional accuracy of metrology workflows with XRM data.…”

Section: Dimensional Metrologymentioning

confidence: 99%

“…A unit of 'voxel size' does not represent a measure of 'spatial resolution', see [1,13]. 8 There are also methods that propose the use of a simple two-sphere phantom dumbbell to determine and correct voxel size errors. However, these are not reliable because they measure only one distance, so they rely on a single data point for interpolation and would only scale lengths of similar dimensions to that distance.…”

Section: Dimensional Metrologymentioning

confidence: 99%

“…The only two reference documents with procedures for testing dimensional 3D x-ray systems are the VDI/VDE 2630-1.3 9 The MTX workflow was conceived specifically for the ZEISS Xradia Versa instruments, but with further software development it could be applied to other XRM systems.…”

Section: Xrm Workflow For Dimensional Metrologymentioning

confidence: 99%

“…In accordance with the VDI/VDE 2630-1.3 guideline, Carl Zeiss Industrielle Messtechnik GmbH [8,38] developed a length standard multisphere called the 'XRM Check' to verify the accuracy of dimensional CT measurements on small volumes that fit in a 5 mm field-of-view (FOV). This length standard consists of 22 identical 300 µm diameter ruby spheres attached to a supporting pillar structure made of fused silica (or quartz glass, with coefficient of thermal expansion α ≈ 0.55 µm m −1 • C −1 ).…”

Section: Xrm Workflow For Dimensional Metrologymentioning

confidence: 99%

See 4 more Smart Citations

Improving the dimensional accuracy of 3D x-ray microscopy data

Villarraga-Gómez

Kotwal

Parwani

et al. 2022

Meas. Sci. Technol.

Self Cite

View full text Add to dashboard Cite

X-ray microscopy instruments have the unique ability to achieve nondestructive imaging with higher spatial resolutions than traditional X-ray computed tomography (CT) systems. This unique ability is of interest to industrial quality control entities, as they deal with small features in precision manufactured parts. Since many of today’s technology and manufacturing companies demand increasingly higher levels of precision, accuracy, and reliability for dimensional measurements on feature sizes that are much smaller than 5mm, it would be ideal to further expand the imaging capabilities of X-ray microscopy to the field of precision metrology. To address such demand, this paper describes the development of a measurement workflow, through a package consisting of hardware and software, to improve the accuracy of dimensional data obtained with 3D X-ray microscopes (XRM). The workflow, called Metrology Extension (MTX), was designed to adjust and configure the XRM instrument work-zone to perform dimensional measurements. The main adjustments of an XRM instrument through MTX workflow, which must be implemented before scanning parts of interest for dimensional evaluation, include applying a distortion map correction on the image projections produced by the X-ray detector and a voxel scale correction prior to data reconstruction. The main purpose of this article is to present, evaluate, and analyze the experimental results of various measurement tests to verify the metrological performance of several XRM systems operating with the MTX workflow. The main results show that these systems can produce repeatable and reproducible measurements, with repeatability standard deviations of the order of 0.1μm, reproducibility standard deviations of less than 0.5μm, and measurement accuracies comparable to those offered by high-precision tactile coordinate measurement machines (with deviations within the range of ±0.95µm). Therefore, once the MTX workflow is executed, XRM instruments can be used to measure small volumes, in the order of (5mm)3 or less, with improved dimensional accuracy.

show abstract

Section: Introductionmentioning

confidence: 87%

Section: Dimensional Metrologymentioning

confidence: 99%

Section: Dimensional Metrologymentioning

confidence: 99%

Section: Xrm Workflow For Dimensional Metrologymentioning

confidence: 99%

Section: Xrm Workflow For Dimensional Metrologymentioning

confidence: 99%

See 3 more Smart Citations

Improving the dimensional accuracy of 3D x-ray microscopy data

Villarraga-Gómez

Kotwal

Parwani

et al. 2022

Meas. Sci. Technol.

Self Cite

View full text Add to dashboard Cite

show abstract

Extending the measurement capabilities of 3D X-ray microscopy to dimensional metrology

Villarraga-Gómez,

Kotwal,

Zarnetta

2024

Int. J. Metrol. Qual. Eng.

View full text Add to dashboard Cite

In the industry of manufactured and assembled devices, the miniaturization and integration of small components with feature sizes on the order of 10 mm or smaller leads to new demands for inspection measurement systems. There are requirements for higher levels of resolution, precision, and accuracy, ideally with technologies that measure internal features and avoid causing damage to the original device. Three-dimensional (3D) techniques such as X-ray computed tomography (CT) may be used to non-destructively inspect internal geometries, or features, that are difficult to reach (or impracticable to access) with tactile probes. Traditional CT systems are, however, limited in resolution and achievable measurement accuracy. One alternative would be to use higher resolution instruments such as 3D X-ray microscopes and expand their measurement capabilities to the field of high precision metrology. This paper demonstrates how to perform non-destructive inspection in small-scale volumes, using a field-of-view (FOV) of about 5 mm diameter, and achieve dimensional measurements that are highly repeatable and accurate (with deviations from calibrated data within the ±1 μm range). This capability is relevant for the electronic industry, e.g., for measurements of camera modules or injection molded connectors, and for manufacturing highly efficient components, e.g., fuel spraying injectors and additive manufactured components with small internal features.

show abstract

Improving the dimensional accuracy of computed tomography data obtained with high-resolution 3D X-ray microscopes

Cited by 2 publications

References 16 publications

Improving the dimensional accuracy of 3D x-ray microscopy data

Improving the dimensional accuracy of 3D x-ray microscopy data

Extending the measurement capabilities of 3D X-ray microscopy to dimensional metrology

Contact Info

Product

Resources

About