2023
DOI: 10.1021/acsomega.3c01951
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Improving the Through-Thickness Thermal Conductivity of Carbon Fiber/Epoxy Laminates by Direct Growth of SiC/Graphene Heterostructures on Carbon Fibers

Abstract: Poor thermal conductivity in the through-thickness direction is a critical limitation in the performance of carbon fiberreinforced polymer (CFRP) composites over a broad range of applications in the aviation industry, where heat dissipation is required (e.g., battery packs, electronic housing, and heat spreaders). In this work, it is demonstrated for the first time that a hierarchical network of vertically oriented graphene nanoflakes (GNFs), with nanoconfined silicon carbide (SiC) nanocrystals, self-assembled… Show more

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“…However, owing to its low crystallinity, epoxy resin exhibits low thermal conductivity (TC), which limits its application in thermal interface materials. Therefore, it has become crucial to improve the TC of epoxy resin. …”
Section: Introductionmentioning
confidence: 99%
“…However, owing to its low crystallinity, epoxy resin exhibits low thermal conductivity (TC), which limits its application in thermal interface materials. Therefore, it has become crucial to improve the TC of epoxy resin. …”
Section: Introductionmentioning
confidence: 99%