Epoxy resin is extensively applied in the electronics
and electrical
fields because of its outstanding comprehensive performance. However,
the low thermal conductivity (TC) limits its application in thermal
interface materials. In the present work, epoxy-based hybrid composites
with high TC were prepared by using expanded graphite (EG) and copper
(Cu) nanoparticles as thermally conductive hybrid fillers via hot
blending and compression-curing processes. Additionally, the influence
of the Cu content on the thermal properties, mechanical properties,
and morphology of each epoxy/EG/Cu composite was investigated. According
to the results, the epoxy/EG/Cu composite showed a maximum TC of 9.74
W/(m·K) at a fixed EG content of 60 wt % owing to the addition
of 10 wt % Cu. After the addition of 10 wt % Cu, the flexural strength,
flexural modulus, and impact strengths of epoxy/EG/Cu composites were
improved from 27.9 MPa, 9.72 GPa, and 0.81 kJ/m2 to 37.5
MPa, 10.88 GPa, and 0.91 kJ/m2, respectively. Hence, this
study offers a feasible strategy for the design of epoxy hybrid composites
with excellent TC that can be applied to thermal interface materials.