2019
DOI: 10.1016/j.matpr.2019.07.036
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Improving the uniformity of the coating thickness distribution during electroplating treatment of products using multi anode baths

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Cited by 12 publications
(10 citation statements)
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“…This shows that the optimal level of thickness uniformity of the brass layer and can protect the headrest connector is the electroplating process with 4 anodes in symmetrical positions. This is in accordance with previous research [10]. This research discusses plating using nickel.…”
Section: Discussionsupporting
confidence: 93%
See 1 more Smart Citation
“…This shows that the optimal level of thickness uniformity of the brass layer and can protect the headrest connector is the electroplating process with 4 anodes in symmetrical positions. This is in accordance with previous research [10]. This research discusses plating using nickel.…”
Section: Discussionsupporting
confidence: 93%
“…Flat anodes are very easy and inexpensive to manufacture. Cylindrical wheelchair headrest connector can be electroplated using plate-shaped anodes, but it needs to be designed in such a way that the coating adheres evenly to the surface of the cylinder [10]. The position of the anode needs to be made in a circle according to the outer surface of the wheelchair headrest.…”
Section: Introductionmentioning
confidence: 99%
“…The industrial pure iron strip Q235 was used as the soluble anode. In industry practice, a number of anodes are placed in an electroplating bath to improve the thickness uniformity of components [ 33 ]. In the present study, four anodes were laid out at each corner of the electrochemical cell.…”
Section: Experimental Procedures For Electrodepositionmentioning
confidence: 99%
“…[8][9][10][11][12][13][14] The functionality of electroplating is essentially enabled by the thin layer that it would deposit on a substrate. [15][16][17][18][19][20][21][22][23][24][25] With a view achieve greater process control over electroplating, researchers around the world have long been carrying out fundamental studies to understand the kinetics of electroplating. [26][27][28][29][30] As such, there exists high demand for research tools that can characterize the growth rates of electroplated layers.…”
Section: Introductionmentioning
confidence: 99%