2022
DOI: 10.1016/j.enbuild.2022.112546
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Improving thermal insulation properties of lightweight epoxy resin matrix composites with millimeter-sized hollow glass microspheres/epoxy hollow spheres

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Cited by 22 publications
(16 citation statements)
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“…T 5 and T 10 are the temperatures corresponding to mass loss of 5% and 10%, respectively, and are commonly considered the initial decomposition temperatures of the materials 13 . It was found that the values of T 5 and T 10 increased with the increase of HGM content.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…T 5 and T 10 are the temperatures corresponding to mass loss of 5% and 10%, respectively, and are commonly considered the initial decomposition temperatures of the materials 13 . It was found that the values of T 5 and T 10 increased with the increase of HGM content.…”
Section: Resultsmentioning
confidence: 99%
“…Hollow glass microspheres (HGM) have the advantages of light weight, non-combustible, extremely stable chemical properties and heat resistance, [10][11][12] low thermal conductivity and high compressive strength, 13 and are often used as inorganic fillers. The application of HGM in the modification of polyethylene, polyamide, and silicone resin has been reported.…”
Section: Introductionmentioning
confidence: 99%
“…The hollow microsphere filling strategy is to add hollow microspheres (inorganic microspheres, organic microspheres) directly to the epoxy resin system, and ERCF can be obtained after curing and molding. Currently, there is an increasing number of studies on the preparation of ERCF using hollow glass microspheres (HGM) and expandable microspheres 20–23 . For example, Olusegun A et al 21 prepared ERCF by adding HGM, and the study showed that the properties of composite foam could be effectively controlled by changing the volume fraction of HGM in the matrix.…”
Section: Introductionmentioning
confidence: 99%
“…Currently, there is an increasing number of studies on the preparation of ERCF using hollow glass microspheres (HGM) and expandable microspheres 20–23 . For example, Olusegun A et al 21 prepared ERCF by adding HGM, and the study showed that the properties of composite foam could be effectively controlled by changing the volume fraction of HGM in the matrix. However, most of the microspheres have volume limits for addition, for example, the maximum filling volume of HGM in the resin matrix is about 60%–70%, which means that the density of the foam is limited, once exceeding this volume ratio, non‐uniform dispersion will be formed in the composite thus reducing the performance of ERCF 24–27 .…”
Section: Introductionmentioning
confidence: 99%
“…Hollow glass microsphere is a kind of new inorganic powder material developed in recent years, with excellent performance such as small particle size, high compressive strength, rich source, inexpensive, insulation, thermal insulation, and insulation, have a good application on paint, insulation materials, fire-fighting materials, glass ceramic and polymer materials [6][7][8][9] . HGB can improve the thermal insulation of the coating and reduce the surface and internal temperature of the composite coated with the coating; it can be used as a reinforcing modifier and stabilizer to improve the strength and thermal stability of polyimide foaming materials; and as a modifier to improve the mechanical properties of thermoplastic resin composites [7][8][9][10][11] . Because of the low density of the hollow sphere structure, HGB can be directly added to the polymer to reduce the density of the composites.…”
Section: Introductionmentioning
confidence: 99%