We have analyzed the mechanism of off-leakage current in a lightly doped drain ͑LDD͒ poly-Si thin film transistor ͑TFT͒ structure using a two-dimensional device simulation and by evaluating the temperature dependence. The off-leakage current in the selfaligned TFTs is mainly caused by band-to-band tunneling, and the off-leakage current in the LDD TFTs is mainly caused by phonon-assisted tunneling with the Poole-Frenkel effect. The carrier generation mostly occurs near the intersection of the frontinsulator interface and the interface between the LDD and drain regions because both the electron and hole densities are simultaneously low and the electric field is strong.Poly-Si thin film transistors ͑TFTs͒ 1 have been widely utilized for flat-panel displays, such as liquid-crystal displays, 2 organic light emitting diode displays, 3 and electronic papers, 4 as well as driver circuits and system-on-panel units, 5 and have been recently applied not only to sensors 1 but also to general electronics 6 such as information processors. 7 The enhancement of the on current and the reduction of the off-leakage current have been strongly required and simultaneously achieved by replacing poly-Si TFTs with a selfaligned ͑S/A͒ structure by those with a lightly doped drain ͑LDD͒ structure. 8 The mechanism of the off-leakage current in S/A TFTs has been frequently reported, [9][10][11][12][13][14][15][16] whereas that in LDD TFTs should be sufficiently discussed. 9 In this research, we have analyzed the mechanism of the offleakage current in LDD poly-Si TFTs using a two-dimensional ͑2D͒ device simulation and by evaluating the temperature dependence. The off-leakage current for high gate voltage ͑Vgs͒ and drain voltage ͑Vds͒ in S/A TFTs is mainly caused by band-to-band tunneling ͑BBT͒, 15 and it is newly found that the off-leakage current for any Vgs and Vds in LDD TFTs is mainly caused by phonon-assisted tunneling with the Poole-Frenkel effect ͑PAT͒. It is visualized that the carrier generation mostly occurs near the intersection of the front-insulator interface and the interface between the LDD and drain regions because both the electron and hole densities are simultaneously low and the electric field is strong in the LDD TFTs evaluated in this paper.
LDD Poly-Si TFTThe LDD poly-Si TFT was fabricated as follows ͑Fig. 1͒. [17][18][19] First, an amorphous-Si film was deposited on a glass substrate using low pressure chemical vapor deposition of Si 2 H 6 , crystallized using a XeCl excimer laser, and then patterned to form a poly-Si film whose thickness ͑t Si ͒ was 50 nm. Next, a SiO 2 film was deposited using plasma-enhanced chemical vapor deposition of tetraethylorthosilicate to form a gate-insulator film whose thickness ͑t SiO2 ͒ was 75 nm. Afterward, a photoresist was patterned using photolithography as an implantation mask, and phosphorus ͑P͒ ions were implanted to form source and drain regions whose dose density was 2 ϫ 10 15 cm −2 , acceleration voltage was 55 keV, and carrier density ͑n+͒ was 2.3 ϫ 10 19 cm −3 , which were det...