2013
DOI: 10.1186/1556-276x-8-86
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In situ accurate control of 2D-3D transition parameters for growth of low-density InAs/GaAs self-assembled quantum dots

Abstract: A method to improve the growth repeatability of low-density InAs/GaAs self-assembled quantum dots by molecular beam epitaxy is reported. A sacrificed InAs layer was deposited firstly to determine in situ the accurate parameters of two- to three-dimensional transitions by observation of reflection high-energy electron diffraction patterns, and then the InAs layer annealed immediately before the growth of the low-density InAs quantum dots (QDs). It is confirmed by micro-photoluminescence that control repeatabili… Show more

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Cited by 13 publications
(9 citation statements)
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“…It consists of a 243 nm thick GaAs core layer on top of a 1500 nm thick Al 0.9 Ga 0.1 As cladding layer. The single layer of self-assembled In(Ga)As QDs is embedded in the core layer and was grown using the indium gradient growth method, 17 which guarantees a low QD density of ∼10 7 cm −2 optimized for the fabrication of single-QD devices with the emission wavelength ranging from 900 to 930 nm. To unify different coordinate systems during the marker-based deterministic device fabrication workflow, an array of metal square markers was patterned on the selected wafer area through an electron beam lithography (EBL)-based lift-off process.…”
Section: ■ Methodsmentioning
confidence: 99%
“…It consists of a 243 nm thick GaAs core layer on top of a 1500 nm thick Al 0.9 Ga 0.1 As cladding layer. The single layer of self-assembled In(Ga)As QDs is embedded in the core layer and was grown using the indium gradient growth method, 17 which guarantees a low QD density of ∼10 7 cm −2 optimized for the fabrication of single-QD devices with the emission wavelength ranging from 900 to 930 nm. To unify different coordinate systems during the marker-based deterministic device fabrication workflow, an array of metal square markers was patterned on the selected wafer area through an electron beam lithography (EBL)-based lift-off process.…”
Section: ■ Methodsmentioning
confidence: 99%
“…Dilute InAs QDs are grown in epitaxy on semi-insulating GaAs (001) substrates with a gradient indium flux and subcritical deposition amount [ 13 ] and integrated in a planar GaAs/Al 0.9 Ga 0.1 As DBR cavity with CM at 910~920 nm (Q~1300). As Figure 1 f indicates, QDs with no donor show a dominant X + from background p-impurity; hole traps induce a secondary X by a slow tunnel capture [ 14 ]; delicate modulated Si doping added above QDs populate dominant X and XX.…”
Section: Methodsmentioning
confidence: 99%
“…QDs were grown at a rate of 0.005 monolayer/s in As4 flux pressure of 1 × 10 −6 Torr at a nominal temperature (T) 540 °C. A sacrificed QD layer was grown first to monitor island by reflection high energy electron diffraction (RHEED) and determine the proper indium deposition amount [28,29] and then evaporated at 670 °C for 15 min until the point array in RHEED pattern disappeared (the residual indium atoms were removed). After a 80 nm GaAs capping at 580 °C to flatten the surface and space a possible defect introduced in the sacrificed layer, the formal QDs were grown without substrate rotation to yield gradient indium flux and QD density along [1-10] [30,31].…”
Section: Methodsmentioning
confidence: 99%