2024
DOI: 10.1021/acsami.3c13969
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In Situ Copper Coating on Silicon Particles Enables Long Durable Anodes in Lithium-Ion Batteries

Yanan Xu,
Yu Zhang,
Qing Hu
et al.

Abstract: Addressing the significant obstacles of volume expansion and inadequate electronic conductivity in silicon-based anode materials during lithiation is crucial for achieving a long durable life in lithium-ion batteries. Herein, a high-strength copper-based metal shell is coated in situ onto silicon materials through a chemical combination of copper citrate and Si–H bonds and subsequent heat treatment. The formed Cu and Cu3Si shell effectively mitigates the mechanical stress induced by volume expansion during lit… Show more

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Cited by 5 publications
(2 citation statements)
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“…Figure 4 b,e reveal values of 0.686 and 0.789, respectively, implying a mixed electrochemical kinetics mechanism in the Si@Sn@C and Si@void@C electrodes. The contribution ratio of the reaction rates of the Si@Sn@C and Si@void@C electrodes can be computed using Formula (2): where and represent the diffusion-controlled and surface-controlled capacities [ 49 , 50 ], respectively. Figure 4 c,f demonstrate that the capacitive contribution ratios of Si@Sn@C and Si@void@C at a scan rate of 0.8 mV s −1 are 71% and 74%, respectively.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…Figure 4 b,e reveal values of 0.686 and 0.789, respectively, implying a mixed electrochemical kinetics mechanism in the Si@Sn@C and Si@void@C electrodes. The contribution ratio of the reaction rates of the Si@Sn@C and Si@void@C electrodes can be computed using Formula (2): where and represent the diffusion-controlled and surface-controlled capacities [ 49 , 50 ], respectively. Figure 4 c,f demonstrate that the capacitive contribution ratios of Si@Sn@C and Si@void@C at a scan rate of 0.8 mV s −1 are 71% and 74%, respectively.…”
Section: Resultsmentioning
confidence: 99%
“…where k 1 v and k 2 v 0.5 represent the diffusion-controlled and surface-controlled capacities [49,50], respectively. Figure 4c,f demonstrate that the capacitive contribution ratios of Si@Sn@C and Si@void@C at a scan rate of 0.8 mV s −1 are 71% and 74%, respectively.…”
Section: Resultsmentioning
confidence: 99%