The record power conversion efficiency (PCE) of single-junction perovskite solar cells (PSCs) has skyrocketed to 25.7% after rapid development in the last decade. [1] The p-i-n PSCs has demonstrated remarkable performance with negligible hysteresis, [2] reliable operation, and good compatibility with state-of-the-art tandem devices. [3] However, it is still inevitable to encounter the instability of the perovskite layer and the commonly used electron-transport layer (ETL) of phenyl-C61-butyric acid methyl ester (PCBM), [4] delaying further improvement on the device stability. [1b,5] With regard to the perovskite layer issue, the main reason is that perovskite material is vulnerable to humidity, thermal, ultraviolet light, and ion migration. [6] In addition, a higher defect density will also accelerate the decomposition process of perovskite under light or thermal. [7] As for the PCBM layer, it is sensitive to humidity and will auto-aggregate under continuous light and/or thermal due to its relatively weak intermolecular interaction. [8] In addition, it allows I À to diffuse from the perovskite layer to the metal electrode, which is unfavorable to the long-term stability of the device. [9] Thus, strategies for both enhancing the intrinsic stability of perovskite including decreasing the defect density and improving its ability against humidity, light, and thermal stress as well as enhancing the intermolecular interaction of PCBM are very necessary to further prolong the operational stability of p-i-n PSCs.Additive engineering of perovskite precursor has been widely investigated to regulate crystal growth or defect passivation for efficient and stable PSCs, [10] including Lewis acid, [11] Lewis base, [12] alkyl ammonium salt, [13] low-dimensional perovskite, [14] or ionic liquid, [15] and so on. Along with the evolvement of these additive strategies, [10a,b] a kind of additive with cross-linking effect stands out, [16] which can suppress ions migration and meanwhile passivate defects at grain boundaries. [16a,17] Recently, Song et al. introduced poly(ethylene glycol) dimethacrylate (PEGDMA) into perovskite precursor ink, achieving an effective chemically anchor at the grain boundaries, regulating the crystallization and reducing grain-boundary defects by the in situ cross-linking polymerization after thermal annealing process of perovskite films. In addition, the in situ cross-linking of PEGDMA can limit the thermal expansion of perovskites during thermal annealing, which released the residual strain to enhance the mechanical stability of the perovskite film. [18] Sun et al. adopt a cross-linking oligomer of trimethylolpropane ethoxylate triacrylate to improve both the efficiency and stability of PSCs.