2019
DOI: 10.1016/j.ceramint.2019.06.161
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In-situ Cu-doped MnCo-spinel coatings for solid oxide cell interconnects processed by electrophoretic deposition

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Cited by 45 publications
(19 citation statements)
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“…Metal powders such as Al, Zn, Cu and Ni are often used as low-IR-emissivity pigments [ 29 , 30 , 31 ] for their high reflectivity, hence small absorption and low emissivity. Al powders are very frequently used owing to their low cost and low density [ 29 , 30 , 31 , 32 , 33 ]. In this work, graphene and Al powders are added to epoxy resin coatings to perform the functions of anticorrosion and low-emissivity pigment, respectively.…”
Section: Introductionmentioning
confidence: 99%
“…Metal powders such as Al, Zn, Cu and Ni are often used as low-IR-emissivity pigments [ 29 , 30 , 31 ] for their high reflectivity, hence small absorption and low emissivity. Al powders are very frequently used owing to their low cost and low density [ 29 , 30 , 31 , 32 , 33 ]. In this work, graphene and Al powders are added to epoxy resin coatings to perform the functions of anticorrosion and low-emissivity pigment, respectively.…”
Section: Introductionmentioning
confidence: 99%
“…Since a bipolar interconnect has a relatively complex shape, with a system of channels that supply fuel and the oxidant in the interior of a fuel cell stack, it appears that the most efficient method which can be used to deposit homogeneous spinel layers is electrophoretic deposition (EPD) [63][64][65][66][67][68].…”
Section: Introductionmentioning
confidence: 99%
“…An interesting modification of the composition of the (Mn,Co) 3 O 4 spinel was presented by Smeacetto et al [68], who introduced 5 or 10 mass% of CuO powder into a Mn 1.5 Co 1.5 O 4 powder suspension during the electrophoretic co-deposition of a layer on the Crofer 22 APU ferritic steel. This made it possible to considerably simplify the technological process used to obtain Mn-Co-Cu-O spinel coatings, which are characterized by high phase stability, resistance to oxidation at 800 °C and, moreover, low ASR comparable to that of a layered system consisting of steel and a coating based on spinel without any copper addition.…”
Section: Introductionmentioning
confidence: 99%
“…EPD is a fast and versatile process that allows homogeneous layers to be deposited in few seconds, and in a RT condition on complexly shaped steel components [ 22 , 23 , 24 ]. Furthermore, EPD offers the possibility to tune the spinel composition “in-situ”, by co-depositing the base spinel together with the desired amounts of Fe 2 O 3 [ 25 , 26 ] or CuO [ 7 , 27 ], in order to obtain, respectively, iron or copper doped and modified manganese–cobalt spinel coatings. In a recently published article by Sabato et al [ 28 ], EPD was proved to be an optimal deposition method to coat real dimension SOFC interconnects: despite the numerous corrugated and channeled surfaces on the Crofer 22 APU interconnect, the EPD-deposited Mn–Co spinel-based coating showed great stability and maintained protective properties after the stack test at 850 °C.…”
Section: Introductionmentioning
confidence: 99%