In-situ deposition of three-dimensional graphene on selective laser melted copper scaffolds for high performance applications

Abstract

Currently, three-dimensional graphene (3DG) fabrication was restricted by the complicated process, strict chemical reactions as well as structural accuracy. Herein we creatively propose a bottom-up strategy that leverages selective laser melting (SLM) technique to manufacture a three-dimensional (3D) porous copper template. Graphene was then in-situ grown via chemical vapor deposition (CVD) on the obtained template, forming 3DG composites. A combination of conventional graphene growth via CVD technique with SLM fabricated scaffold templates enabled an accurate design and regulation of 3DG from macro-structure (unit type, porosity, aperture) to micro-structure (texture, surface quality) through an elaborately manipulated porous copper scaffold. The 3DG/copper scaffold could achieve around 88 % and 27 % enhancement in electromagnetic interference (EMI) shielding and thermal diffusion, respectively. Particularly, the highest EMI shielding efficiency (SE) can reach up to 47.8 dB at 2.7 GHz 2 and exhibit an average SE of 32.3 dB at the range of 2-18 GHz. The synergistic shielding mechanisms accounted for the improvement derived from the use of hybrid composite materials and precise architecture of the SLM porous structure.

New construction strategies of carbon‐based composites for flexible electromagnetic interference shielding films

“…In addition, CVD technology is complex and costly, and cannot continuously prepare CNF for a long time, this makes it difficult to build a conductive system. [80][81][82][83][84][85][86][87] CNF prepared by has been used for EMI protection, but its volume is large, EMI shielding performance is not enough, and its flexibility is poor. In addition, the CVD method is complex and costly, and cannot generate continuous long CNF, which is essential for constructing conductive CNF networks.…”

Recent advances in 2D graphene reinforced metal matrix composites

“…For example, inspired by the application of template-directed CVD in synthesis of 3D foam-like graphene foams (3D-GFs) [62], a 3D porous Cu scaffolds made by AM was used as substrate putting into the vacuum chamber during fabrication of graphene/MMCs. Excepting for the enhanced thermal diffusion, the unexpected higher electromagnetic interference shielding and the specially designed porous structure were obtained [63]. Although many metal materials, such as Cu, Pt, Ni, Fe etc are used as substrate in CVD to obtain graphene with large quantity and good quality, Cu is the best choice with high stability and is suitable for industrialization.…”

Graphene-Reinforced Copper Matrix Composites as Electrical Contacts

“…Owing to its exceptional properties such as remarkable electron mobility, thermal conductivity, exceptional mechanical flexibility, and immense specific surface area, graphene, a two-dimensional honeycomb carbon structure, has been widely utilized in ceramic, polymer, or metallic matrix for the development of advanced composites with remarkable mechanical, electrical, and thermal characteristics. − However, exploiting the unique properties of graphene in copper matrix composites presents a colossal challenge due to the tendency of graphene nanosheets (GNSs) to stack and agglomerate, as well as the density difference between graphene and the copper matrix. − Besides, the equilibrium contact angle of copper on graphene or graphite was measured to be approximately 140°, indicating a nonwetting feature of the interface between copper and graphene, according to the Young–Dupré equation, as well as easy agglomeration of graphene and poor interfacial bonding in the sintered copper matrix. , Consequently, considerable research on graphene-reinforced copper matrix composites has been conducted with the aim of hindering restacking of graphene and achieving homogeneous dispersion of graphene in the copper matrix. Hwang et al constructed homogeneously distributed graphene/Cu composites with an enhanced elastic modulus of 131 GPa and yield strength of 284 MPa via molecular-level mixing (MLM) and spark plasma sintering (SPS) .…”