In Situ Growth of Silver Film on Polyimide with Tuned Morphologies for Flexible Electronics

Liu, Rui; Wang, Ke; Liu, Zhangming; Xu, Yuan; Wang, Qi; Luo, Mengxue; Shi, Xinzhi; Ye, Shuangli

doi:10.1021/acs.langmuir.1c01392

Cited by 9 publications

(6 citation statements)

References 32 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…First, good adhesion between metal Ag and PI can be realized by in situ metallization of the PI film. The adhesion is much stronger than that of devices fabricated by inkjet-printed Ag ink or Ag coating on the PI film, 41,47,48 which is demonstrated by the peeling-off experiment. Second, Ag antenna patterned on the PI film can be achieved by the ion-exchange technique together with the inkjet-printing method, which shows a permittivity-dependent resonance frequency.…”

Section: Introductionmentioning

confidence: 90%

Surface Engineering on Polyimide–Silver Films in Low-Cost, Flexible Humidity Sensors

Luo

Liu

Wang

et al. 2022

ACS Appl. Mater. Interfaces

Self Cite

View full text Add to dashboard Cite

In this work, surface engineering is applied to polyimide (PI) films to fabricate low-cost Ag/PI wireless humidity sensors with a resonant frequency of 2.45 GHz. The sensors were obtained by in situ metallization technique coupled with inkjet printing, where PI plays triple roles as a flexible substrate, ion-exchange surface, and sensing material to moisture. Moreover, the humidity sensitivity can be enhanced by the improvement of hydrophilicity via loading with different ions on the PI surface, which has been demonstrated by Fourier transform infrared (FTIR), X-ray photoelectron spectroscopy (XPS), and contact angle measurements. The wireless humidity sensor loaded with K+ ions has the maximum sensitivity of 97.7 kHz/% RH at a low relative humidity range of 20–65% and 359.7 kHz/% RH at a high relative humidity of 65–90%, respectively. Accordingly, a sensing mechanism of the fabricated humidity sensor has been discussed in detail. On the other hand, the characteristics of the humidity sensor such as response and recovery speed and stability are analyzed. The mechanical performance tests show that the humidity sensor displays excellent flexibility and good mechanical stability. A strong adhesion between the Ag antenna and PI substrate can be found as well. The passive wireless humidity sensor described in this work has the advantages of having a simple structure, low cost, high sensitivity, long-term stability, and good mechanical properties, which has potential applications in automated industry and healthcare with real-time humidity monitoring.

show abstract

Section: Introductionmentioning

confidence: 90%

Surface Engineering on Polyimide–Silver Films in Low-Cost, Flexible Humidity Sensors

Luo

Liu

Wang

et al. 2022

ACS Appl. Mater. Interfaces

Self Cite

View full text Add to dashboard Cite

show abstract

“…Previous studies have shown that the IESM process results in metal films having nanoscale thickness with relatively low electrical conductivity compared to bulk silver metal. [21,[33][34][35][36] In order to improve electrical conductivity, a process was developed to use either silver or palladium nanoparticles deposited through IESM as the catalyst to initiate electroless plating of copper from an aqueous electrolyte solution. Electroless deposition is an autocatalytic process such that the copper metal on the surface will catalyze plating of additional copper.…”

Section: Electroless Copper Depositionmentioning

confidence: 99%

Flexible Copper Metal Circuits via Desktop Laser Printed Masks

Ghosh

Liu

Yates

2022

Adv Materials Technologies

View full text Add to dashboard Cite

A novel process is demonstrated that produces patterns of electrically conductive copper on a flexible polyimide film substrate using standard desktop laser printed toner and near room temperature aqueous chemistry. The laser toner acts as a mask to selectively block the ion exchange self‐metallization (IESM) reduction reaction that forms nanoscale silver or palladium coatings at the polyimide surface. The silver or palladium IESM coating is then used as a catalyst for electroless deposition of copper. Under appropriate conditions, the copper is deposited selectively on top of the catalyst layer. The resulting copper layer has a measured sheet resistance as low as 0.3 Ohms/sq. Electrical isolation is measured between copper traces spaced as close as 300 microns, and high conductivity is measured along traces with widths as low as 200 microns. The minimum pattern size appears to be limited primarily by the resolution of the laser toner pattern, as the IESM metal layer is observed to follow the contours of individual toner particles. The process avoids the use of high temperature, vacuum, and organic solvents and is thus suitable for very low cost prototyping or distributed manufacturing of simple electronic devices.

show abstract

“…1−3 With the rapid development of flexible electronic materials in recent years, high-performance colorless and transparent PI films have been favorable candidates for flexible substrates of foldable screens, 4 solar panels, 5 and other electronic equipment. 6,7 At present, commercial optical polymer films for flexible circuitry substrates are mainly focused on polyolefins and polyesters. Nevertheless, these materials usually suffer poor thermal properties and dimensional stability.…”

Section: ■ Introductionmentioning

confidence: 99%

“…Polyimide (PI) is a high-performance polymer with exceptional properties, such as outstanding thermal stability, remarkable chemical resistance, excellent mechanical properties, high transparency, and low dielectric constant, and has been extensively applied in the aerospace, microelectronics, and optoelectronics industries. − With the rapid development of flexible electronic materials in recent years, high-performance colorless and transparent PI films have been favorable candidates for flexible substrates of foldable screens, solar panels, and other electronic equipment. , …”

Section: Introductionmentioning

confidence: 99%

Polyimide Films Containing Trifluoromethoxy Groups with High Comprehensive Performance for Flexible Circuitry Substrates

Wang

Zhou

Feng

et al. 2022

ACS Appl. Polym. Mater.

View full text Add to dashboard Cite

The outstanding overall performance of polyimide (PI) films is critical for their application in the microelectronic and optoelectronic industries. A series of novel PI films containing trifluoromethoxy groups were prepared from a 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA)/2,2′-bis (trifluoromethyl) biphenyl-4,4′-diamine (TFMB)/2,2′-bistrifluoromethoxy-biphenyl-4,4′-diamine (TFMOB) tri-copolymer in this paper. The comprehensive performances of the derived PI films could be modulated by the molar ratio of TFMOB/TFMB, and each performance of the PI films was explored in detail. All PI films exhibited excellent overall performance against PI-ref (PI films were prepared by PMDA and ODA in our lab, which referred to the raw materials of Kapton films), especially PI-30, which possessed the best performance, such as remarkable thermal stability (T 5% = 581 °C and T g = 368 °C), outstanding mechanical properties (T S = 195 MPa and T M = 3.5 GPa), ultralow moisture absorption (M a = 0.74%), lower dielectricity (D k = 2.877 and D f = 0.00815 at 10 GHz), and high optical transparency. In addition, PI-50 had the largest breaking elongation (E b = 27.6%), PI-70 had the lowest dielectric loss (D f = 0.00514), and PI-100 presented the lowest moisture absorption (M a = 0.50%). Each PI film possessed its own unique advantages to meet the special demand. Subsequently, the PI-30 film was used as a colorless and transparent substrate for flexible circuits, which could withstand multiple bends and still maintained excellent electrical performance after 1,40,000 folding times. The high comprehensive performance makes these PI films favorable candidates for flexible circuit substrates, foldable screens, and solar panels in the optoelectronic engineering and microelectronics industries.

show abstract

In Situ Growth of Silver Film on Polyimide with Tuned Morphologies for Flexible Electronics

Cited by 9 publications

References 32 publications

Surface Engineering on Polyimide–Silver Films in Low-Cost, Flexible Humidity Sensors

Surface Engineering on Polyimide–Silver Films in Low-Cost, Flexible Humidity Sensors

Flexible Copper Metal Circuits via Desktop Laser Printed Masks

Polyimide Films Containing Trifluoromethoxy Groups with High Comprehensive Performance for Flexible Circuitry Substrates

Contact Info

Product

Resources

About