In situ investigation of nanometric cutting of 3C-SiC using scanning electron microscope

Tian, Dongyu; Xu, Zongwei; Liu, Lei; Zhou, Zhanqi; Zhang, Junjie; Zhao, Xuesen; Hartmaier, Alexander; Liu, Bing; Song, Le; Luo, Xichun

doi:10.1007/s00170-021-07278-x

Cited by 17 publications

(9 citation statements)

References 52 publications

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“…Their results suggest that, the deformation behavior of cutting depends on the existence of a different phase within SiC [16]. This is also confirmed in the atomistic study of Liu et al [17,18], as well as in the experimental study of Tian et al [19], where the formation of a thin amorphous phase is observed. Although the formation of an amorphous phase is observed during molecular dynamics simulations and experiment, the typical thickness of such an amorphous layer is rather small, and this phase is metastable with respect to the ground state of SiC [20].…”

Section: Introductionsupporting

confidence: 58%

“…It is noted here that the constitutive model used in this work does not cover phase transformations that might occur in the material. In particular, atomistic studies show that a phase transformation to the amorphous phase may occur under the high pressure caused by the machining process of SiC [10,16,17,19,20]. However, this amorphous layer is typically very thin and would be smaller than the element size in our simulations.…”

Section: Constitutive Model For 3c-sicmentioning

confidence: 95%

“…After analyzing brittle and ductile cutting modes for the brittle 3C-SiC ceramic and comparing the suitedness of the cutting force and the surface roughness as indicators for the type of cutting mode, our results are compared to findings in the literature to further clarify the mechanisms leading to ductile or brittle cutting. Tian et al [19] have identified the BDT depth for 3C-SiC to lie within a range of 21-39 nm. Their SEM analysis of the surface morphology at 21 nm depth of cut showed mostly plastic material removal by shearing.…”

Section: Verification Of Brittle and Ductile Cutting Modelsmentioning

confidence: 99%

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Finite Element Modeling of Brittle and Ductile Modes in Cutting of 3C-SiC

et al. 2021

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Machining of brittle ceramics is a challenging task because the requirements on the cutting tools are extremely high and the quality of the machined surface strongly depends on the chosen process parameters. Typically, the efficiency of a machining process increases with the depth of cut or the feed rate of the tool. However, for brittle ceramics, this easily results in very rough surfaces or even in crack formation. The transition from a smooth surface obtained for small depths of cut to a rough surface for larger depths of cut is called a brittle-to-ductile transition in machining. In this work, we investigate the mechanisms of this brittle-to-ductile transition for diamond cutting of an intrinsically brittle 3C-SiC ceramic with finite element modeling. The Drucker–Prager model has been used to describe plastic deformation of the material and the material parameters have been determined by an inverse method to match the deformation behavior of the material under nanoindentation, which is a similar loading state as the one occurring during cutting. Furthermore, a damage model has been introduced to describe material separation during the machining process and also crack initiation in subsurface regions. With this model, grooving simulations of 3C-SiC with a diamond tool have been performed and the deformation and damage mechanisms have been analyzed. Our results reveal a distinct transition between ductile and brittle cutting modes as a function of the depth of cut. The critical depth of cut for this transition is found to be independent of rake angle; however, the surface roughness strongly depends on the rake angle of the tool.

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Section: Introductionsupporting

confidence: 58%

Section: Constitutive Model For 3c-sicmentioning

confidence: 95%

Section: Verification Of Brittle and Ductile Cutting Modelsmentioning

confidence: 99%

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Finite Element Modeling of Brittle and Ductile Modes in Cutting of 3C-SiC

et al. 2021

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“…At present, a great number of experiments [5][6][7][8] and simulations [9][10][11][12][13] have been carried out to investigate the deformation mechanisms of 3C-SiC. For instance, Mishra et al performed large-scale molecular dynamics (MD) simulations of nanoindentation and found that the primary deformation mechanisms of 3C-SiC are dislocation nucleation and propagation in the low pressure (zincblende) phase [11].…”

Section: Introductionmentioning

confidence: 99%

Peridynamic simulations of damage in indentation and scratching of 3C-SiC

Zhu

2022

Journal of Materials Research

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The cubic silicon carbide (3C-SiC) has broad application prospects in many fields due to its excellent material properties. The modeling of damage in 3C-SiC due to contact loads is important yet challenging. In this paper, simulations based on ordinary state-based peridynamics (PD) theory are proposed to model the damage of 3C-SiC in indentation and scratching. The constitutive parameters of 3C-SiC for PD simulation are obtained by performing MD simulations of nanoindentation. It is found that in the indentation simulations the initiation and propagation of cracks are observed, which shows that the PD can model the crack formation and propagation in the indentation process of brittle solid materials. During the scratching process, the variation of friction force is consistent with that of material wear. It is also found that the specific cutting energy increases nonlinearly with the decrease of scratching depth due to size effect. In addition, for the scratching with double indenters, the volume of material removal is more than twice that of scratching with an indenter due to the coupling effect of the two indenters under certain conditions. This paper demonstrates that PD is a powerful tool to investigate the indentation and scratching process of brittle solid materials.

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“…Оптическая спектроскопия является одним из мощнейших инструментов, применяемых в химических и физических науках для изучения структуры широкого круга материалов [1,2].…”

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Application of an Indenter-Objective for Optical Spectroscopy of the Structure and Properties of Materials

Reshetov¹,

Sultanova²,

Useinov³

et al. 2021

ChemChemTech

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Рассмотрены возможности использования инденторов-объективов для оптических и спектрометрических исследований локальных свойств и структуры материалов. Такие инденторы благодаря специальной огранке позволяют получать полноценное оптическое изображение исследуемой области поверхности образца во время выполнения измерений методами индентирования и царапания. На противоположных концах такого алмазного индентора формируются две центрально симметричные пирамиды Берковича, повернутые относительно друг друга на 60°. Эти пирамиды образуют три плоскопараллельных пластины, через которые квазипараллельный пучок света от микроскопа проходит, не претерпевая полного внутреннего отражения, как к образцу, так и обратно. Представленные данные получены с использованием индентора в форме двухсторонней трехгранной пирамиды Берковича. Продемонстрировано измерение спектров рассеяния Рамана и Мандельштама-Бриллюэна из области под индентором с помощью серийных спектрометров. Показано, что, комбинируя оптические и механические методы исследования, можно получить детальную информацию о фазовом состоянии вещества при интенсивной пластической деформации. Предложенный подход применим как к прозрачным, так и непрозрачным материалам, поскольку наблюдение происходит через прозрачный алмазный индентор-объектив. Обсуждается возможность одновременного картографирования оптических и механических свойств исследуемого материала с пространственной привязкой получаемых данных с микронной точностью. Продемонстрировано отслоение алмазоподобной пленки при индентировании, изменение фазового состава кремния в области развитой пластической деформации, измеренного медом Рамановской спектроскопии, рассчитана скорость звука в деформированном алмазным индентором пластике методом рассеяния Мандельштама-Бриллюэна. Ожидается, что данный подход, совмещающий оптические и механические методы исследования, будет продуктивным при исследовании высокомолекулярных полимерных материалов и фармацевтических препаратов, склонных к формированию поликристаллических структур и попадающих в разные конформационные состояния.

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In situ investigation of nanometric cutting of 3C-SiC using scanning electron microscope

Cited by 17 publications

References 52 publications

Finite Element Modeling of Brittle and Ductile Modes in Cutting of 3C-SiC

Finite Element Modeling of Brittle and Ductile Modes in Cutting of 3C-SiC

Peridynamic simulations of damage in indentation and scratching of 3C-SiC

Application of an Indenter-Objective for Optical Spectroscopy of the Structure and Properties of Materials

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