In situ Observation of Grain Growth on Electroplated Cu Film by Electron Backscatter Diffraction

Abstract

In situ observations using an automated electron backscatter diffraction (EBSD) system with a heating stage were carried out to clarify the mechanism of grain growth on electroplated Cu and Cu deposited by physical vapor deposition (PVD). Hardness measurements and EBSD observations revealed that the strain in electroplated Cu and Cu deposited by PVD was released by annealing. Little preferential orientation of the texture was observed in electroplated Cu, while Cu deposited by PVD showed strong (111) texture. A greater number of twin boundaries were observed in electroplated Cu than in Cu deposited by PVD. Grains surrounded by random grain boundaries were more enlarged by annealing in electroplated Cu than those in Cu deposited by PVD. Since segregation of impurities with a low melting point, such as sulfur, to grain boundaries could promote grain growth, which is often accompanied by twin boundary formation, the reason that many twin boundaries are found in electroplated Cu is considered to be the existence of impurities such as sulfur at grain boundaries. The effect of a twin grain boundary on resistivity was calculated and the contribution of a twin grain boundary to resistivity was found to be much less than that of a random grain boundary. #

In-Situ Scanning Electron Microscopy/Electron Backscattered Diffraction Observation of Microstructural Evolution during α → γ Phase Transformation in Deformed Fe-Ni Alloy

“…Improvement in EBSD scan speed since it was developed make it possible to apply this technique to in-situ observation of microstructural evolution. [14][15][16][17][18][19][20][21][22][23][24][25][26] We have conducted in-situ EBSD observations of a fi c phase transformation, and revealed the influence of GB microstructure, particularly of GB character and triple junction (TJ) character, in a parent phase on nucleation and growth of c phase. [23] Also, Lischewski et al studied the texture of austenite phase and the mobility of a/c interphase boundaries using in-situ EBSD technique.…”

Large Discrete Resistance Jump at Grain Boundary in Copper Nanowire

“…The trenches between copper nanowires appear black as a result of the nonexistent or poor quality EBSD patterns that are misindexed as high density of “dislocations”. It can be seen that the Cu lines contain high fraction of coincidence GBs (white for Σ3 and red for Σ9) with a few high-angle random GBs, typical for electroplated Cu films . The misorientations of some GBs (marked in Figure a) are given below in the Bunge axis/angle notation:…”

“…It can be seen that the Cu lines contain high fraction of coincidence GBs (white for Σ3 and red for Σ9) with a few high-angle random GBs, typical for electroplated Cu films. 17 The misorientations of some GBs (marked in Figure 1a) are given below in the Bunge axis/angle notation: Random GB: GB1 -〈753〉 45.89°; GB2 -〈321〉 48.669°; GB3 -〈321〉 50.72°; GB4 -〈952〉 48.681°and 〈654〉 46.496°.…”

Development of <i>In-situ</i> Orientation Mapping and Microstructure Observation System for Ferrite/Austenite and Martensitic Transformations in Steel

“…(EBSD) is available to provide microstructure information such as crystalline grain's phase and its orientation, 11) therefore, in-situ observation based on SEM/EBSD measurement during heat treatment recently has been known as very popular technique. [12][13][14][15][16][17][18][19][20][21][22][23] Since bainitic and martensitic transformation are occurred by rapid cooling of austenite such as oil quench and water quench, a rapid cooling system is required to directly observe the above transformation in an in-situ SEM/EBSD observation system. However, it is difficult to cool down a sample quickly because the sample is placed in a vacuum chamber of the system.…”