In situ observation of ultrasonic flip-chip bonding using high-speed camera

Shuto, Takahide; Asano, Tanemasa

doi:10.7567/jjap.54.030204

Cited by 11 publications

(3 citation statements)

References 21 publications

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“…Besides this work, we have shown from results of in situ observation using a high-speed camera that the bump almost completely deformed at about 50 ms of the initial stage of the ultrasonic process. 19,20) These results indicate that the observed decrease in the average compressive strain is attributed to the "softening" of the bump metal under the application of ultrasonic. Softening of the metal under the application of ultrasonic was pointed out by Langenecker and others.…”

Section: Resultsmentioning

confidence: 80%

“…To further extend this technology to devices such as a mega connection image sensor, clarification of the bonding mechanism is highly demanded to shrink the pixel pitch. In our previous works, [18][19][20] we have shown that recrystallization of grains of the microbump takes place under the application of ultrasonic vibration. Figure 1(b) shows cross-sectional transmission electron microscopy (TEM) images of a bump bonded by ultrasonic bonding at room-temperature.…”

Section: Introductionmentioning

confidence: 95%

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Bonding dynamics of compliant microbump during ultrasonic bonding investigated by using Si strain gauge

Iwanabe

Nakadozono

Senda

et al. 2016

Jpn. J. Appl. Phys.

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The bonding dynamics of a cone-shaped microbump during ultrasonic bonding are investigated by in situ measurements of the strain generated in a substrate using a piezoresistance strain sensor. The strain sensor is composed of a pair of p- and n-type piezoresistance gauges to extract strain components in the ultrasonic vibration along the plane parallel to the substrate surface and along the direction perpendicular to the surface. Flip-chip bonding is performed at room-temperature. The time evolution of the strain generated in the substrate according to the load-up of pressing force and application of ultrasonic vibration is clearly detected. The softening of the bump metal during the application of ultrasonic vibration is clearly observed. Results of a comparative study between the bonding of a cone-shaped microbump and that of a flat-top microbump suggest mechanical stress concentration near the top end of the cone-shaped microbump, which results in the transformation of the crystal texture of the bump from grains to fine crystallites.

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Section: Resultsmentioning

confidence: 80%

Section: Introductionmentioning

confidence: 95%

Bonding dynamics of compliant microbump during ultrasonic bonding investigated by using Si strain gauge

Iwanabe

Nakadozono

Senda

et al. 2016

Jpn. J. Appl. Phys.

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“…Numerous on-line measurements and in-situ observations of temperature [3,10,18,21], interfacial frictional force (power) [9,21,[23][24][25][26][27], frictional slip (relative motion) at the bonding interface [3,9,23,24,28], ultrasonic vibration [21,[28][29][30], deformation behavior [29,31], contact resistance [32], and electrical signals from ultrasonic generators [33] during ultrasonic bonding have been performed. The on-line measurements and in-situ observations are extremely useful and informative for comprehension of ultrasonic microjoining.…”

Section: Introductionmentioning

confidence: 99%

In-Situ Observation of Adhesion Behavior During Ultrasonic Al Ribbon Bonding

et al. 2019

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In-situ observation was performed on a transparent silica substrate during ultrasonic Al ribbon bonding, using a high-speed video camera with differing frame rates, 10 4 fps and 10 3 fps, to clarify the adhesion behavior. The bonding process was observed as follows. Initially, friction slip occurred, producing multiple island streaks in the direction parallel to the ultrasonic vibration. The island streaks were formed as a scratch, due to surface waviness of the Al ribbon. Momentarily, a belt-shaped bond zone was formed at the center, normally due to the ultrasonic vibration. The island streaks could be clearly observed at 10 4 fps. However, the central belt zone was unclear and appeared translucent at 10 4 fps; although it was clear when observed at 10 3 fps. The island streaks were unclear at 10 3 fps. The positional relation of the island streaks and the central belt zone was confirmed from in-situ observation results of a twist and peel test of Al ribbon bonded to silica substrate. The central belt zone was between the island streaks and the silica substrate.

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A novel rapid micromotion compensator for high-precision chip bonding manufacturing

Zhang

Gao

2021

Precision Engineering

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In situ observation of ultrasonic flip-chip bonding using high-speed camera

Cited by 11 publications

References 21 publications

Bonding dynamics of compliant microbump during ultrasonic bonding investigated by using Si strain gauge

Bonding dynamics of compliant microbump during ultrasonic bonding investigated by using Si strain gauge

In-Situ Observation of Adhesion Behavior During Ultrasonic Al Ribbon Bonding

A novel rapid micromotion compensator for high-precision chip bonding manufacturing

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