In situ preparation and sintering of silver nanoparticles for low-cost and highly reliable conductive adhesive

Chen, Shilong; Liu, Konghua; Luo, Yuanfang; Jia, Demin; Gao, Hong; Hu, Guojun; Liu, Lan

doi:10.1016/j.ijadhadh.2013.04.004

Cited by 19 publications

(13 citation statements)

References 21 publications

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“…Electrically conductive adhesives (ECAs) have been widely applied in electronic research and development and the functionalities of ECA for applications on paper, PET and PLA have been proven [17]. There are several possible options for the conductive ink used for PCBs.…”

Section: Introductionmentioning

confidence: 99%

Alternative Materials for Printed Circuit Board Production: An Environmental Perspective

et al. 2021

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This article investigates the potential environmental impacts of four-layer printed circuit board (PCB) production from cradle to grave. The study starts with a lifecycle assessment of conventional PCB production. Then, the alternative materials of polyethylene terephthalate (PET), polylactic acid (PLA)/glass fiber composite and paper are investigated for the substrate. A conventional PCB adopts copper as the conductive material and requires an etching process. The environmental impacts of changing the conductive deposition method to an additive method by printing silver nanoparticles is studied. In a conventional PCB, electricity generation contributes 41% of the global warming potential (GWP) and 38% of the abiotic resource depletion (ADP), in the fossil category. By applying an additive manufacturing method, the GWP of PCB manufacturing can be reduced to 14% of that of the conventional method. A sensitivity analysis of silver recycling illustrates that a 40% higher silver recycling rate would decrease the GWP of silver material by about 48–60%. Uncertainty in the energy consumption of PCB production would alter the environmental impacts; however, even with the most conservative energy consumption in a conventional PCB production method, the environmental impacts of the additive method are about five times lower than those of conventional PCB production.

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Section: Introductionmentioning

confidence: 99%

Alternative Materials for Printed Circuit Board Production: An Environmental Perspective

et al. 2021

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“…One of the main obstacles is that the use of a large number of metal fillers in ECAs is costly and impairs the adhesion of ECAs. 6,7 Therefore, it is imperative to develop high-performance ECAs with a minimized amount of silver fractions.…”

Section: Introductionmentioning

confidence: 96%

“…In the past decade, electrically conductive adhesives (ECAs) have become straightforward and scalable alternatives for hazardous Sn–Pb solders for traditional interconnecting processes of electronic devices. , ECAs with excellent electrical performance, low costs, low processing temperature, and minimal environmental hazards are required. − Despite the fact that ECAs have many advantages over long-established tin/lead solder, there are still some deficiencies that need to be further overcome to meet the needs of the next-generation interconnect materials. One of the main obstacles is that the use of a large number of metal fillers in ECAs is costly and impairs the adhesion of ECAs. , Therefore, it is imperative to develop high-performance ECAs with a minimized amount of silver fractions.…”

Section: Introductionmentioning

confidence: 99%

Highly Conductive and Highly Dispersed Polythiophene Nanoparticles for Fabricating High-Performance Conductive Adhesives

Cao

Cui

Wang

et al. 2020

ACS Appl. Electron. Mater.

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The continuous advancement of modern electronic equipment requires increasing the conductivity of electrically conductive adhesives (ECAs), but the gap between discrete silver flakes in conventional ECAs considerably hinder electron transport. In this work, we demonstrated 1500fold enhancement in electrical conductivity by adding a kind of polythiophene nanoparticle (PTh nanoparticles) in the polyurethane-based ECAs with an optimal value of 3.2 × 10 4 S/cm. These PTh nanoparticles have exceptionally high conductivity and are capable of forming a stable colloidal suspension in various kinds of organic solvents. These properties enable PTh nanoparticles to be well-distributed in the polymer matrix and enable gap-filling among Ag flakes to fabricate high-performance ECAs. In the presence of PTh nanoparticles, the resulting ECA has not only outstanding conductivity but also excellent electrical stability under high mechanical deformation. The electrical resistivity of the pattern made by the PTh nanoparticles-containing ECAs remained stable after being wrapped in a 6 mm bend radius for over 7500 cycles or pressed under 1000 kPa. In addition, when the ECAs were stored for 2 weeks at 80 °C and 60% relative humidity, no significant change in conductivity of the ECAs was observed. A flexible printed circuit was fabricated using the above-mentioned ECAs containing PTh nanoparticles, demonstrating their potential for advanced flexible electronic devices.

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“…In recent years, silver nanoparticles (AgNPs) have been extensively investigated for their appealing properties and applied to many fields, such as bacteriostat [ 1 , 2 ], conductive adhesives [ 3 , 4 ], metal-enhanced fluorescence, surface-enhanced Raman scattering [ 5 , 6 ], catalytic fuel degradation [ 7 , 8 ], etc. Due to their low toxicity, high thermal stability, and low volatility, they may also be used in water purification, food preservation, cosmetics, and so on [ 9 ].…”

Section: Introductionmentioning

confidence: 99%

Enhanced Antibacterial Performance and Cytocompatibility of Silver Nanoparticles Stabilized by Cellulose Nanocrystal Grafted with Chito-Oligosaccharides

Wang

Yue

et al. 2018

Materials

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The agglomeration of silver nanoparticles (AgNPs) results in poor antibacterial performance, and the accumulation of silver in the human body threatens human health. Preparing a matrix is a technique worth considering as it not only prevents the aggregation of AgNPs but also reduces deposition of AgNPs in the human body. In this paper, carboxy-cellulose nanocrystals (CCNC) were prepared by a simple one-step acid hydrolysis method. Chito-oligosaccharides (CSos) were grafted onto the surface of CCNC to form CSos-CCNC composite nanoparticles. CCNC and CSos-CCNC were used as stabilizers for deposing AgNPs and two types of complexes—AgNPs-CCNC and AgNPs-CSos-CCNC—were obtained, respectively. The influence of the two stabilizer matrices—CCNC and CSos-CCNC—on the morphology, thermal behavior, crystal structure, antibacterial activity, and cell compatibility of AgNPs-CCNC and AgNPs-CSos-CCNC were examined. The results showed that the AgNPs deposited on the CSos-CCNC surface had a smaller average diameter and a narrower particle size distribution compared with the ones deposited on CCNC. The thermal stability of AgNPs-CSos-CCNC was better than that of AgNPs-CCNC. AgNPs did not affect the crystalline structure of CCNC and CSos-CCNC. The antibacterial activity of AgNPs-CSos-CCNC was better than that of AgNPs-CCNC based on antibacterial studies using Escherichia coli, Staphylococcus aureus, and Klebsiella pneumoniae. The cytotoxicity of AgNPs-CSos-CCNC was remarkably lower than that of AgNPs-CCNC.

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In situ preparation and sintering of silver nanoparticles for low-cost and highly reliable conductive adhesive

Cited by 19 publications

References 21 publications

Alternative Materials for Printed Circuit Board Production: An Environmental Perspective

Alternative Materials for Printed Circuit Board Production: An Environmental Perspective

Highly Conductive and Highly Dispersed Polythiophene Nanoparticles for Fabricating High-Performance Conductive Adhesives

Enhanced Antibacterial Performance and Cytocompatibility of Silver Nanoparticles Stabilized by Cellulose Nanocrystal Grafted with Chito-Oligosaccharides

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