In-situ repair qualification by applying Computational Metrology and Inspection (CMI) technologies

Chen, C. Y.; Wei, Ivan; Tuo, Laurent C.; Yoo, Chue-San; Chen, Dongxue; Peng, Danping; Satake, Masaki; Su, Bo; Pang, Liang

doi:10.1117/12.2030688

Cited by 1 publication

(1 citation statement)

References 0 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Luminescent continued working on computational inspection and metrology technologies to enable mask inspection, mask review, and mask repair ready for ILT masks, until it was acquired by KLA in 2012, and TSMC EBO presented a number of papers together with Luminescent showing such capabilities deployed in production. [92][93][94][95][96][106][107][108][109][110][111][112][113][114] ILT was the topic of panel discussion at the SPIE Photomask Technology Conference for two consecutive years in 2015 and 2016. The industry also recognized the issue of using VSB mask writers to write curvilinear ILT masks.…”

Section: History Of Inverse Lithographymentioning

confidence: 99%

Inverse lithography technology: 30 years from concept to practical, full-chip reality

Pang

2021

J. Micro/Nanopattern. Mats. Metro.

View full text Add to dashboard Cite

In lithography, optical proximity and process bias/effects need to be corrected to achieve the best wafer print. Efforts to correct for these effects started with a simple bias, adding a hammer head in line-ends to prevent line-end shortening. This first-generation correction was called rule-based optical proximity correction (OPC). Then, as chip feature sizes continued to shrink, OPC became more complicated and evolved to a model-based approach. Some extra patterns were added to masks, to improve the wafer process window, a measure of resilience to manufacturing variation. Around this time, the concept of inverse lithography technology (ILT), a mathematically rigorous inverse approach that determines the mask shapes that will produce the desired on-wafer results, was introduced. ILT has been explored and developed over the last three decades as the next generation of OPC, promising a solution to several challenges of advanced-node lithography, whether optical or extreme ultraviolet (EUV). Today, both OPC and ILT are part of an arsenal of lithography technologies called resolution enhancement technologies. Since OPC and ILT both involve computation, they are also considered as part of computational lithography. We explore the background and history of ILT and detail the significant milestones that have taken full-chip ILT from an academic concept to a practical production reality.

show abstract

Section: History Of Inverse Lithographymentioning

confidence: 99%

Inverse lithography technology: 30 years from concept to practical, full-chip reality

Pang

2021

J. Micro/Nanopattern. Mats. Metro.

View full text Add to dashboard Cite

show abstract

In-situ repair qualification by applying Computational Metrology and Inspection (CMI) technologies

Cited by 1 publication

References 0 publications

Inverse lithography technology: 30 years from concept to practical, full-chip reality

Inverse lithography technology: 30 years from concept to practical, full-chip reality

Contact Info

Product

Resources

About