In-situ SEM investigation of sub-microscale deformation fields around a crack-tip in silicon

Li, J.J.; Zhao, Chunwang; Xing, Yongming; Hou, Xianhua; Zhang, Fan; Jin, Yongjun; Wang, Y.

doi:10.1016/j.optlaseng.2012.07.017

Cited by 13 publications

(4 citation statements)

References 22 publications

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“…Finally, the use of the grid method at the microscopic scale is reported in various papers, see for instance Refs. , for measuring strain near a dislocation , for observing singularities like disclinations in nanoparticles , for measuring residual stresses and for measuring deformation near a crack tip. Strain fields were also measured in many other situations, for instance, around low‐angle grain boundaries , in silicon transistors , in nanowires or in MEMS devices .…”

Section: Examplesmentioning

confidence: 99%

The Grid Method for In‐plane Displacement and Strain Measurement: A Review and Analysis

Grédiac

Sur

Blaysat

2016

Strain

141

162

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The grid method is a technique suitable for the measurement of in-plane displacement and strain components on specimens undergoing a small deformation. It relies on a regular marking of the surfaces under investigation. Various techniques are proposed in the literature to retrieve these sought quantities from images of regular markings, but recent advances show that techniques developed initially to process fringe patterns lead to the best results. The grid method features a good compromise between measurement resolution and spatial resolution, thus making it an efficient tool to characterise strain gradients. Another advantage of this technique is the ability to establish closed-form expressions between its main metrological characteristics, thus enabling to predict them within certain limits. In this context, the objective of this paper is to give the state of the art in the grid method, the information being currently spread out in the literature. We propose first to recall various techniques that were used in the past to process grid images, to focus progressively on the one that is the most used in recent examples: the windowed Fourier transform. From a practical point of view, surfaces under investigation must be marked with grids, so the techniques available to mark specimens with grids are presented. Then we gather the information available in the recent literature to synthesise the connection between three important characteristics of full-field measurement techniques: the spatial resolution, the measurement resolution and the measurement bias. Some practical information is then offered to help the readers who discover this technique to start using it. In particular, programmes used here to process the grid images are offered to the readers on a dedicated website. We finally present some recent examples available in the literature to highlight the effectiveness of the grid method for in-plane displacement and strain measurement in real situations.

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Section: Examplesmentioning

confidence: 99%

The Grid Method for In‐plane Displacement and Strain Measurement: A Review and Analysis

Grédiac

Sur

Blaysat

2016

Strain

141

162

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“…Therefore, the measured area by GPA is limited within a nanometer scope, which confined its application for a large area measurement. In fact, combining with advanced grating fabrication techniques, GPA can also be used to measure the deformation at the macro-and microscales [28][29][30]. For large area measurements using the GPA method, the mean relative error of the strain is approximately 1.5% [31].…”

Section: Introductionmentioning

confidence: 99%

Experimental Investigation of Crack Propagation and Strain Fields Evolution around a Crack Tip in 5A05 Aluminum Alloy

Zhao

et al. 2018

Metals

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In situ scanning electron microscopy three-point bending test was employed in this study to investigate the crack initiation and propagation in 5A05 aluminum alloy. The microscale strain fields around the crack tip were measured by using the geometric phase analysis method. Results show that prior to the crack initiation, the normal strain εyy (y direction is perpendicular to the load direction) was tensile around the notch, whereas the normal strain εxx (x direction is parallel to the load direction) was compressive around the notch. The shear strain εxy was nearly zero. With the increase in load, the normal strains εyy and εxx gradually increased, but the change in shear strain εxy was not evident. When the stresses at several sharp points at the notch root reached the breaking strengths, a few microcracks initiated at these points. At this moment, the normal strains εyy and εxx were much greater than the shear εxy, and dominated the strain fields around the crack tip. In the crack propagation process, the normal strains εyy and εxx, and the shear strain εxy dominated the strain fields around the crack tip, thereby leading to a Z-form of crack propagation path in the specimen.

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“…Recently, combining with the advanced fabrication techniques of high-frequency gratings [8][9][10], GPA has been widely used in the deformation measurement at micro-and nano-scale [11][12][13][14][15][16][17]. The traditional GPA method, referred to as FT-GPA in this paper, is based on the relationship between the displacement and the phase difference.…”

Section: Introductionmentioning

confidence: 99%

Geometric phase analysis based on the windowed Fourier transform for the deformation field measurement

Dai

Xie

Wang

2014

Optics & Laser Technology

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In-situ SEM investigation of sub-microscale deformation fields around a crack-tip in silicon

Cited by 13 publications

References 22 publications

The Grid Method for In‐plane Displacement and Strain Measurement: A Review and Analysis

The Grid Method for In‐plane Displacement and Strain Measurement: A Review and Analysis

Experimental Investigation of Crack Propagation and Strain Fields Evolution around a Crack Tip in 5A05 Aluminum Alloy

Geometric phase analysis based on the windowed Fourier transform for the deformation field measurement

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