In situ sintered silver decorated 3D structure of cellulose scaffold for highly thermoconductive electromagnetic interference shielding epoxy nanocomposites

Abstract

This study presents a 3-dimensional (3D) network structure of cellulose scaffold (CS), which was in situ decorated with silver nanoparticles (AgNPs). The scaffold was then infiltrated with epoxy matrix and cured at elevated temperature to sinter the AgNPs; finally, highly thermoconductive epoxy composites (Ag@CS/epoxy) was obtained. The resultant Ag@CS20/epoxy composite reached a thermal conductivity of 2.52 WÁm À1 ÁK À1 at 2.2 vol% of filler loading, which shows an enhancement of over 11-folds in the thermal conductivity compared to the neat epoxy. The superb electrical conductivity value of over 53,691 SÁm À1 of the Ag@CS20/epoxy was achieved, which led to exceptional EMI SE values of 69.1 dB. Furthermore, surface temperatures during heating and cooling were also investigated to demonstrate the superior heat dissipating capacity of the Ag@CS/epoxy composite, which can be potentially put an application as thermal dissipating material in the next generation of electronics.

Ultrathin Aramid Nanofiber Composites with Alternating Multilayered Structure of Silver Nanowires and Boron Arsenide: Toward Superior Electrically Insulating Thermoconductive Electromagnetic Interference Shielding Materials

“…Interestingly, there is an increase in EMI SE with increasing temperature which can be observed, increasing from 53 dB at room temperature to about 64 dB at 200 °C. The enhancement of EMI SE with increasing temperature can be attributed to the merge of AgNWs at the interfaces at high temperatures which is demonstrated by the previous reports. − Additionally, the improvement implies excellent thermal stability and retention of the EMI shielding property of the 5-layer composites up to 200 °C. This can be attributed to the thermal stability of the components ANF, BA, and AgNWs.…”