Ultrathin perfluoropolyether–silane
(PFPE–silane)
films offer excellent functionality as antifingerprint coatings for
display touchscreens due to their oleophobic, hydrophobic, and good
adhesion properties. During smartphone use, PFPE–silane coatings
undergo many abrasion cycles which limit the coating lifetime, so
a better understanding of how to optimize the film structure for improved
mechanical durability is desired. However, the hydrophobic and ultrathin
(1–10 nm) nature of PFPE–silane films renders them very
difficult to experimentally characterize. In this study, the cohesive
fracture energy and elastic modulus, which are directly correlated
with hardness and better wear resistance of 3.5 nm-thick PFPE–silane
films were, respectively, measured by double cantilever beam testing
and atomic force microscopy indentation. Both the cohesive fracture
energy and modulus are shown to be highly dependent on the underlying
film structure. Both values increase with optimal substrate conditions
and a higher number of silane groups in the PFPE–silane precursor.
The higher cohesive fracture energy and modulus values are suggested
to be the result of the changes in the film chemistry and structure,
leading to higher cross-linking density. Therefore, future work on
optimizing PFPE–silane film wear resistance should focus on
pathways to improve the cross-linking density. Subcritical fracture
testing in humid environments reveals that humidity negatively affects
the fracture properties of PFPE–silane films.