2016
DOI: 10.1007/s11664-016-4413-9
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Incorporation of Mg in Free-Standing HVPE GaN Substrates

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Cited by 14 publications
(3 citation statements)
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“…Memory effects following the intentional incorporation of iron can also lead to unintentional incorporation of iron in subsequent growth processes [9]. Secondary ion mass spectroscopy (SIMS) on bulk GaN samples grown using hydride vapor phase epitaxy (HVPE) [10,11] revealed the presence of iron incorporated unintentionally at concentrations of 10 15 cm −3 [10]. The unintentional incorporation of iron in these samples was (at least partially) attributed to the Mg source used for p-type doping.…”
Section: Introductionmentioning
confidence: 99%
“…Memory effects following the intentional incorporation of iron can also lead to unintentional incorporation of iron in subsequent growth processes [9]. Secondary ion mass spectroscopy (SIMS) on bulk GaN samples grown using hydride vapor phase epitaxy (HVPE) [10,11] revealed the presence of iron incorporated unintentionally at concentrations of 10 15 cm −3 [10]. The unintentional incorporation of iron in these samples was (at least partially) attributed to the Mg source used for p-type doping.…”
Section: Introductionmentioning
confidence: 99%
“…As the HVPE sample cooled after growth, the GaN separated from the substrate due to thermal stress and was polished, resulting in free-standing GaN doped with 3.0 × 10 18 cm −3 Mg. The detailed growth process and additional characterization was described previously [16][17][18][19].…”
Section: Experimental Parametersmentioning
confidence: 99%
“…[12,21,22] The electrical properties of GaN are mainly controlled by in situ doping during the growth. Shallow donors (Si [23,24] and Ge [25,26] ), shallow acceptors (Mg), [27] and deep level impurities (Fe [28,29] and C [30,31] ) generally serve as the dopants to achieve N-type, P-type, and semi-insulating electrical characteristic of GaN, respectively.…”
Section: Introductionmentioning
confidence: 99%