Increase in Adhesion Strength of Au Thin Film via High-frequency and High-density Electric Current

Kizawa, Kurama; Kimura, Yasuhiro; Toku, Yuhki; Ju, Yang

doi:10.1299/jsmemm.2019.os1409

The Proceedings of the Materials and Mechanics Conference

2019

DOI: 10.1299/jsmemm.2019.os1409

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Increase in Adhesion Strength of Au Thin Film via High-frequency and High-density Electric Current

Kurama Kizawa

Yasuhiro Kimura

Yuhki Toku

et al.

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Increase in Adhesion Strength of Au Thin Film via High-frequency and High-density Electric Current

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