Increasing mechanical strength and refining grains of Cu-core solder joints with pressurized bonding

Song, Rui-Wen; Fleshman, Collin; Wu, Zih-You; Tsai, Shih-Jen; Duh, Jenq‐Gong

doi:10.1007/s10854-020-04824-3

Cited by 2 publications

(1 citation statement)

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“…[3][4][5][6][7][8]. iii) to use optimized thermomechanical (deformation) treatment (e. g. via rotary swaging, or methods of severe plastic deformation) [9][10][11][12]. The mentioned methods of plastic deformation can favorably strengthen the processed materials as they impart the generation of dislocations, which subsequently form dislocation cells and walls and consequently subgrains (typically defined with low angle grain boundaries), which finally develop into individual grains (typically defined with high angle grain boundaries) [13].…”

Section: Introductionmentioning

confidence: 99%

Correlation of structure development and electric characteristics within high pressure torsion processed copper

Kocich,

Kopeček,

Marek

2024

Materialwissenschaft Werkst

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Copper of a high purity features excellent electric conductivity, but generally very low mechanical properties. Nevertheless, optimized deformation/thermomechanical treatment can introduce favorable combinations of both. The presented study characterizes the correlation of microstructure development and electric properties within copper processed by the severe plastic deformation method of high pressure torsion, the primary advantage of which is that it enables to achieve grains with the sizes in the ultra‐fine, or even nano scales. The study investigates structure development during progressive deformation. In other words, samples processed by single and double high pressure torsion revolutions were evaluated from the viewpoints of grain sizes and grain boundaries, and the results were correlated with the experimentally measured electric conductivity. The single high pressure torsion revolution contributed to grain size decrease, while the structure after double revolution exhibited very fine grains, especially at the sample periphery featuring the highest imposed strain. Both the samples also exhibited increases in microhardness (especially after double revolution), and electric conductivity higher than 100 % IACS. The results confirmed that copper conductors featuring enhanced mechanical properties and favorable electric conductivity can be manufactured by severe plastic deformation.

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