Increasing shear strength of Au–Sn bonded joint through nano-grained interfacial reaction products

Peng, Jian; Wang, Meng; Sadeghi, Behzad; Wang, Richu; Liu, Huashan; Cavaliere, Pasquale

doi:10.1007/s10853-020-05623-1

Cited by 5 publications

(2 citation statements)

References 36 publications

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“…Lead is harmful to both the environment and human health, and, thus, the use of high-Pb solders has been restricted [1][2][3]. The Au-Sn-based alloys have been proposed as alternative high-temperature Pb-free solders [4,5]. In particular, the Au-20Sn (wt.%) eutectic alloy is attractive in high-power electronic and optoelectronic devices because of its superior resistance to corrosion and high electrical and thermal conductivity, as well as high mechanical strength [6,7].…”

Section: Introductionmentioning

confidence: 99%

Thermodynamic Description of the Au-Sb-Sn Ternary System

Tong

Rong

et al. 2023

Metals

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Phase equilibria and thermodynamic properties of the Au-Sb-Sn ternary system are important for the design of Au-based alloys as high-temperature lead-free solders to replace high-Pb solders. In this work, phase transition temperatures of five Sb-Sn alloys were measured using differential thermal analysis (DTA), and the temperatures of three invariant reactions were determined. Based on the measured experimental results in this work and the reported results, the Sb-Sn binary system was re-optimized using the CALPHAD method. The calculated results were in good agreement with available phase equilibria and thermodynamic data. This work was further combined with the previous assessments of the Au-Sn and Au-Sb binary systems and the present optimization of the Sb-Sn binary system to calculate the phase equilibria and thermodynamic properties of the Au-Sb-Sn ternary system, according to the reported experimental results, including thermodynamic properties and phase equilibria. The calculated liquidus projection, isothermal sections, vertical sections, as well as enthalpy of mixing and activity of Sn in liquid alloys are consistent well with the reported experimental results. A self-consistent set of thermodynamic parameters was obtained to accurately describe Gibbs energies of various phases in the Au-Sb-Sn ternary system, which would serve as a sound basis for developing a thermodynamic database of multicomponent Au-Sn-based alloy systems.

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Section: Introductionmentioning

confidence: 99%

Thermodynamic Description of the Au-Sb-Sn Ternary System

Tong

Rong

et al. 2023

Metals

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“…Lead-tin solder is the traditional die attach material under high temperatures (about > 350 C) for power electronics packaging [10,11]. Due to the safety of lead and RoHS regulations, optimized lead-free solders such as Au-, Zn-, Bi-, and Sb-based alloys were developed as candidates for high-temperature die-attach materials [12,13]. The shear strength of joints formed by these alloy solders is approximately 20$30 MPa [14].…”

Section: Introductionmentioning

confidence: 99%

Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes

Wang

Zeng

Zhang

et al. 2022

Journal of Electronic Packaging

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Recent years, the sintered silver paste was introduced and further developed for power electronics packaging due to low processing temperature and high working temperature. The pressure-less sintering technology reduces the stress damage caused by the pressure to the chip, improves reliability, and is widely applied in manufacturing. Currently, most existed studies are focused on alcohol-based sintered silver pastes while resins have been demonstrated to improve the bonding properties of solder joints. Hence, the performance and sintering mechanisms with epoxy-based silver paste need to be further explored. In this work, a methodology for multi-factor investigation is settled on the epoxy-based silver paste to reveal the relationship between the strength and the different influence factors. We firstly analyzed the characteristics of commercialized epoxy-based silver paste samples, including silver content, silver particle size, organic paste composition, sample viscosity, and thermal conductivity. Samples were then prepared for shear tests and microstructure analysis under different pressure-less sintering temperatures, holding time, substrate surface, and chip size. Full factor analysis results were further discussed in detail for correlation. The influence factors were ranked from strong to weak as follows: sintering temperature, substrate surface, chip size, and holding time. Finally, a thermal cycling test was carried out for reliability analysis. Epoxy residues are one of the possible reasons which result in shear strength decreasing exponentially.

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