2009
DOI: 10.1016/j.scriptamat.2008.12.018
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Increasing the ductility of ultrafine-grained copper alloy by introducing fine precipitates

Abstract: In the present study, we fabricated the ultra-fine grained (UFG) Cu-Cr-Zr alloy including fine second phase particles through the accumulative roll bonding (ARB) process and subsequent aging treatment. The nano-sized precipitates dispersing within the UFG matrix significantly enhanced strain hardening, resulting in the simultaneous improvement of uniform elongation and tensile strength.

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Cited by 63 publications
(26 citation statements)
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“…None of the aged specimens displayed any precipitates besides ¤-Ni 2 Si precipitates, suggesting that, even after aging, all the Zr atoms dissolve in the Cu matrix. 8) {111} pole figures for 90R, ARB and 90CR were obtained using the Schulz method and a texture goniometer with Cu K ¡ radiation. The {112}©111ª rolling texture, which is a characteristic of pure Cu, was mainly observed for the three specimens.…”
Section: Microstructuresmentioning
confidence: 99%
“…None of the aged specimens displayed any precipitates besides ¤-Ni 2 Si precipitates, suggesting that, even after aging, all the Zr atoms dissolve in the Cu matrix. 8) {111} pole figures for 90R, ARB and 90CR were obtained using the Schulz method and a texture goniometer with Cu K ¡ radiation. The {112}©111ª rolling texture, which is a characteristic of pure Cu, was mainly observed for the three specimens.…”
Section: Microstructuresmentioning
confidence: 99%
“…The contributions of dispersoids and grain boundaries to the reduction of electrical conductivity are the lowest among all the aforementioned defects [1,[13][14][15]. At the same time, dispersoids and grain boundaries provide an ultimate tensile strength of 600 MPa or higher through dispersion hardening and grain size strengthening [11,16]. Currently, this combination of strength and conductivity provided by the superposition of ultrafine-grained (UFG) structure, nanoscale coherent dispersoids and low-solute-content copper containing only traces of Cr and Zr is one of the best for copper and copper alloys.…”
Section: Introductionmentioning
confidence: 99%
“…The strength of copper can be significantly increased by cold working [3][4][5], grain refinement [6][7][8][9][10][11], and the precipitation of nanoscale dispersoids [2,[11][12][13][14][15]. However, strengthening leads to a pronounced decrease in the electrical conductivity, due to increase in the dislocation density, grain boundaries, dispersoids, and solutes, which increase the scattering of conducting electrons [1].…”
Section: Introductionmentioning
confidence: 99%
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“…INTRODUCTION Cu-Cr-Zr alloy, as one of the most promising functional materials, has been extensively researched in recent years [1][2][3][4]. With the combination of excellent electrical and thermal conductivity, good thermal stability at high temperature, relatively high strength, good fatigue resistance, outstanding resistance to corrosion and eas e of fabrication [5][6][7][8][9][10][11] it has been widely used in the applications such as moulds for continuous caster, heat transfer materials , diverter target materials and other important industrial parts [12][13][14][15].…”
mentioning
confidence: 99%