2011
DOI: 10.1134/s1063739711010070
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Increasing the efficiency of photoelectric cells by nanostructuring their surface

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Cited by 2 publications
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“…Multilayers were fabricated by means of a standard silicon wafer with the high dopant level n = 10 16 cm −3 and (100) orientation according to technology described in Ref. . Then vertical square pillars were formed using plasma‐chemical etching by the Bosch process through a Cr mask with lift‐off lithography.…”
Section: Samplesmentioning
confidence: 99%
“…Multilayers were fabricated by means of a standard silicon wafer with the high dopant level n = 10 16 cm −3 and (100) orientation according to technology described in Ref. . Then vertical square pillars were formed using plasma‐chemical etching by the Bosch process through a Cr mask with lift‐off lithography.…”
Section: Samplesmentioning
confidence: 99%