Increasing the reliability of solid state lighting systems via self-healing approaches: A review

Lafont, Ugo; Zeijl, H.W. van; Zwaag, Sybrand van der

doi:10.1016/j.microrel.2011.08.013

Cited by 106 publications

(39 citation statements)

References 192 publications

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“…Many researchers have reported that cracked die degrades the LED electro-optical properties and can cause serious electrical failure [4,18]. Shalesh et al, [19] explained that even an ordinary LED can fail due to cracks in the active area when subjected to a stress test.…”

Section: Tc Test Results and Impact Of Cracked Ge Substrate To Led Elementioning

confidence: 99%

“…Periodical on-off switching and environmental temperature variation during LED operation will induce cyclic stress on the LED. This cyclic stress will start to cause cracks thus leading to fatigue failure [4]. If the die contains a crack or is pre-damaged during the LED manufacturing processes it will easily fail when it undergoes this stress and strain.…”

Section: Introductionmentioning

confidence: 99%

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Impact of severe cracked germanium (111) substrate on aluminum indium gallium phosphate light-emitting-diode’s electro-optical performance

Annaniah¹,

Devarajan

2016

Open Physics

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Abstract:Cracked die is a serious failure mode in the Light Emitting Diode (LED) industry -affecting LED quality and long-term reliability performance. In this paper an investigation has been carried out to find the correlation between severe cracked germanium (Ge) substrate of an aluminum indium gallium phosphate (AlInGaP) LED and its electrooptical performance after the Temperature Cycle (TC) test. The LED dice were indented at several bond forces using a die bonder. The indented dice were analysed using a Scanning Electron Microscope (SEM). The result showed that severe cracks were observed at 180 gF onward. As the force of indentation increases, crack formation also becomes more severe thus resulting in the chipping of the substrate. The cracked dies were packaged and the TC test was performed. The results did not show any electro-optical failure or degradation, even after a 1000 cycle TC test. Several mechanically cross-sectioned cracked die LEDs, were analysed using SEM and found that no crack reached the active layer. This shows that severely cracked Ge substrate are able to withstand a −40 ∘ C/+100 ∘ C TC test up to 1000 cycles and LED optical performance is not affected. A small leakage current was observed in all of the cracked die LEDs in comparison to the reference unit. However, this value is smaller than the product specification and is of no concern.

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Section: Tc Test Results and Impact Of Cracked Ge Substrate To Led Elementioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Impact of severe cracked germanium (111) substrate on aluminum indium gallium phosphate light-emitting-diode’s electro-optical performance

Annaniah¹,

Devarajan

2016

Open Physics

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“…On the contrary, both capsules under analysis provided similar impact results. Figure 19: Pull-out and lap-shear tests evaluating healing adhesion [80][81].…”

Section: Compact Tension Izod Impact Lap Shear/tensile Test Evaluatmentioning

confidence: 99%

“…M a n u s c r i p t . At the same perspective, Lafont applied lap shear testing and evaluated the bonding strength of damaged plane after healing [81]. Lafont, based on well-established lap-shear tests schematically presented in Figure 19b, performed an analytical study on the effect of curing temperature and cross-linking approach on the adhesive bonding built between the healed material and the polymer matrix.…”

Section: Compact Tension Izod Impact Lap Shear/tensile Test Evaluatmentioning

confidence: 99%

Quantifying thermoset polymers healing efficiency: A systematic review of mechanical testing

Tsangouri

Aggelis

Hemelrijck

2015

Progress in Polymer Science

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“…As an increase in the chip junction temperature degrades the conversion efficiency [2]. The higher the current injection level, the more the heat generated from the LED, which causes a severe problem if not efficiently dissipated.…”

Section: Introductionmentioning

confidence: 99%

Estimation of heat dissipation through the interchip structure for a multichip light-emitting diode package via simulation

Bang

Moon

2013

Journal of Information Display

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The heat dissipation through interchip structures was investigated by introducing 4-partition and 16-partition ceramic interchip structures for a 16-chip light-emitting diode (LED) package. Using the finite volume method simulation with ICEPAK V13.0, the temperature distribution inside the LED package and the junction temperature were estimated, from which the effect of the interchip structures on the heat dissipation characteristics of the LED package was investigated. The results showed that the ceramic interchip structures provided a more effective upward heat dissipation path for the LED package and contributed to a 23 • C decrease in the junction temperature for the 4-partition interchip structure and a 51 • C decrease for the 16-partition interchip structure at the 16 W operation.

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Increasing the reliability of solid state lighting systems via self-healing approaches: A review

Cited by 106 publications

References 192 publications

Impact of severe cracked germanium (111) substrate on aluminum indium gallium phosphate light-emitting-diode’s electro-optical performance

Impact of severe cracked germanium (111) substrate on aluminum indium gallium phosphate light-emitting-diode’s electro-optical performance

Quantifying thermoset polymers healing efficiency: A systematic review of mechanical testing

Estimation of heat dissipation through the interchip structure for a multichip light-emitting diode package via simulation

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