Indentation creep study of lead-free Sn–5%Sb solder alloy

Mahmudi, R.; Geranmayeh, A.R.; Bakherad, M.; Allami, M.

doi:10.1016/j.msea.2007.01.060

Cited by 54 publications

(17 citation statements)

References 35 publications

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“…Creep behavior of the lead-free Sn-5%Sb solder alloy in the cast and wrought conditions was investigated by long time Vickers indentation testing under a constant load of 15 N and at temperature in the range 298-405 K [6].…”

Section: Introductionmentioning

confidence: 99%

“…The indentation test provides a simple and non-destructive method of investigating the mechanical properties of solids. This can be particularly advantageous when the material is only available as small test pieces or there are difficulties with the machining of samples made of very soft materials [6,26]. Furthermore, the tensile strength and creep resistance of the eutectic Sn-Bi solder are higher than that of the eutectic Sn-Pb solder [27].…”

Section: Introductionmentioning

confidence: 99%

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Effect of silver and indium addition on mechanical properties and indentation creep behavior of rapidly solidified Bi–Sn based lead-free solder alloys

Shalaby

2013

Materials Science and Engineering: A

111

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Effect of silver and indium addition on mechanical properties and indentation creep behavior of rapidly solidified Bi–Sn based lead-free solder alloys

Shalaby

2013

Materials Science and Engineering: A

111

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“…Although the traditional tensile creep test is the common test for studying creep properties of materials, problems like cost of preparing standard samples, lack of microstructure uniformity and long test periods have limited the application of this method. Therefore, the studies have been conducted on using impression creep test during recent decades [9][10][11][12][13]. In contrast to conventional creep tests, which need tensile or compressive specimens, in this method, all creep data can be obtained with a small piece of material.…”

Section: Introductionmentioning

confidence: 99%

Microstructure and impression creep characteristics Al-9Si-xCu aluminum alloys

Yousefi¹,

Dehnavi²,

Miresmaeili³

2015

Metall Mater Eng

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The effects of 1.5, 2.5 and 3.5 wt.% Cu additions on the microstructure and creep behavior of the as-cast Al-9Si alloy were investigated by impression tests. The tests were performed at temperature ranging from 493 to 553 K and under punching stresses in the range 300 to 414 MPa for dwell times up to 3000 seconds. The results showed that, for all loads and temperatures, the Al-9Si-3.5Cu alloy had the lowest creep rates and thus, the highest creep resistance among all materials tested. This is attributed to the formation of hard intermetallic compound of Al 2 Cu, and higher amount of α-Al 2 Cu eutectic phase. The stress exponent and activation energy are in the ranges of 5.2-7.2 and 115 -150 kJ/ mol, respectively for all alloys. According to the stress exponent and creep activation energies, the lattice and pipe diffusion-climb controlled dislocation creep were the dominant creep mechanism.

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“…Also the elastic modulus, internal friction and stiffness of Sn-Sb based bearing alloys varied after annealing for 2 and 4 h at 120, 140 and 160 C. Creep behavior of SnSb5 alloy and SnPb40Sb2.5 peritectic alloy were studied by long time Vickers indentation testing at room temperature [5][6][7]. Increasing Sb content from 7.5% to 20% provided an increase in hardness.…”

Section: Introductionmentioning

confidence: 99%

Influence of Titanium Oxide on Creep Behavior, Microstructure and Physical Properties of Tin-Antimony and Tin-Aluminum-Antimony Based Bearing Alloys

Bediwi¹,

Grayb²,

Kamal³

2015

IJSEA

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Influence of adding titanium oxide (TiO2) nanoparticles on creep behavior, structure, mechanical and thermal properties of tinantimony-lead and tin-aluminum-antimony bearing alloys have been studied and analyzed. Stress exponent of tin-antimony-lead and tinaluminum-antimony-lead alloys decreased after adding titanium oxide. Elastic modulus of tin-antimony-lead increased after adding titanium oxide. Internal fiction of tin-antimony-lead and tin-aluminum-antimony-lead alloys varied after adding titanium oxide. Microstructure of tinantimony-lead and tin-aluminum-antimony-lead alloys changed after adding titanium oxide. Strengths of tin-antimony-lead and tin-aluminumantimony-lead alloys increased after adding titanium oxide. Thermal parameters of tin-antimony-lead and tin-aluminum-antimony-lead alloys varied after adding titanium oxide. The Sn97Sb51Pb1(TiO2)1 alloy has better bearing properties such as lowest internal friction, high elastic modulus and higher thermal diffusivity for industrial applications .

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Indentation creep study of lead-free Sn–5%Sb solder alloy

Cited by 54 publications

References 35 publications

Effect of silver and indium addition on mechanical properties and indentation creep behavior of rapidly solidified Bi–Sn based lead-free solder alloys

Effect of silver and indium addition on mechanical properties and indentation creep behavior of rapidly solidified Bi–Sn based lead-free solder alloys

Microstructure and impression creep characteristics Al-9Si-xCu aluminum alloys

Influence of Titanium Oxide on Creep Behavior, Microstructure and Physical Properties of Tin-Antimony and Tin-Aluminum-Antimony Based Bearing Alloys

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