“…35,36 Although ammonium hydroxide is commonly used as a complexing agent for electroless Ag plating onto Cu powders (Table S1 †), 31,32,34,[37][38][39][40][41] the stability of the cuprammonium complex and Ag-ammine complex is unsatisfactory. 42,43 It is difficult to control the plating rate and stability of the plating bath, which is a major challenge for large-scale production. In addition, the preparation of Cu@Ag powders using TETA or EDTA as a single complexing agent has also been reported, but the density and smoothness of the Ag shells and the conductivity of the powders are not satisfactory, mainly because they can only regulate the Ag ion release rate in a limited range.…”