2016
DOI: 10.1063/1.4943248
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Indium-bump-free antimonide superlattice membrane detectors on silicon substrates

Abstract: We present an approach to realize antimonide superlattices on silicon substrates without using conventional Indium-bump hybridization. In this approach, PIN superlattices are grown on top of a 60 nm Al0.6Ga0.4Sb sacrificial layer on a GaSb host substrate. Following the growth, the individual pixels are transferred using our epitaxial-lift off technique, which consists of a wet-etch to undercut the pixels followed by a dry-stamp process to transfer the pixels to a silicon substrate prepared with a gold layer. S… Show more

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Cited by 13 publications
(3 citation statements)
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“…In this regard, Zhang et al [191] successfully transferred large-area InAs/InAsSb T2SLs thin film onto a Si substrate through a lift-off method and wafer-bonding techniques. Unlike other transfer methods resulting in conspicuous degradation in electrical performance [192], the LWIR PDs fabricated by this wafer-bonding method exhibited a comparable dark current density to those of reported devices based on traditional GaSb substrates with similar operating conditions. The complete fabrication process including the device epi-structure, transfer process, and fabrication process of PDs is presented in figure 17(c).…”
Section: Sb-based Ir Pds Integrated To a Si Platformmentioning
confidence: 74%
“…In this regard, Zhang et al [191] successfully transferred large-area InAs/InAsSb T2SLs thin film onto a Si substrate through a lift-off method and wafer-bonding techniques. Unlike other transfer methods resulting in conspicuous degradation in electrical performance [192], the LWIR PDs fabricated by this wafer-bonding method exhibited a comparable dark current density to those of reported devices based on traditional GaSb substrates with similar operating conditions. The complete fabrication process including the device epi-structure, transfer process, and fabrication process of PDs is presented in figure 17(c).…”
Section: Sb-based Ir Pds Integrated To a Si Platformmentioning
confidence: 74%
“…Residual Al0.4Ga0.6Sb may result in an increased roughness of the membrane backside, thereby promoting a weak bond between the membrane and the new substrate. Transfer of membranes on metal-coated substrates may also be used to provide the T2SL with electrical contacts via interface bonding (23,33). In this scenario, a residual Al0.4Ga0.6Sb will drastically increase the resistance of the contact.…”
Section: Resultsmentioning
confidence: 99%
“…Fabrication of the 24 μm × 24 μm InAsSb pixels and their transfer to carrier substrates are described in detail in ref. 22 . The pixel period pre-transfer was ~30 μm, and following transfer to the thermal release tape the pixel array consisted of a >4 mm × 4 mm pattern with a fill factor of ~0.5.…”
Section: Methodsmentioning
confidence: 99%