“…A range of different reagents have been used for reductive cleavage of N À O bonds, which included Li/4,4'-di-tert-butylbiphenyl (DTBB), [22,23] Na/Hg amalgam, [24,25] SmI 2 , [14,[26][27][28][29][30] TiCl 3 , [31][32][33][34] indium, [8,11] LiAlH 4 , [35,36] BH 3 , [37] [Mo(CO) 6 ], [13,24,[38][39][40][41][42][43][44][45][46][47][48][49] [Co 2 (CO) 8 ], [50] [Fe(CO) 5 ], [13,51] Zn/H +, [43,[52][53][54][55] NiB 2 , [56] Na 2 S 2 O 4 , [57] [TiA C H T U N G T R E N N U N G (iPrO) 4 ]/EtMgBr, [58] NiH 2 , [59] trimethylsilyl chloride/KI, …”