2020
DOI: 10.1007/978-981-15-5089-8_24
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Indium Phosphide Based Dual Gate High Electron Mobility Transistor

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Cited by 7 publications
(2 citation statements)
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“…However, the donor carrier concentration in the gate-drain region of the MODFET with TT metal is reduced which causes the drain-source resistance (R DS ) to increase [18]. This increases the value of f MAX, which is clearly apparent from equation (5). It can be clearly observed that the use of TT metal between the gate and drain terminal significantly improve the RF parameters of proposed MODFET.…”
Section: Discussion On Obtained Resultsmentioning
confidence: 91%
See 1 more Smart Citation
“…However, the donor carrier concentration in the gate-drain region of the MODFET with TT metal is reduced which causes the drain-source resistance (R DS ) to increase [18]. This increases the value of f MAX, which is clearly apparent from equation (5). It can be clearly observed that the use of TT metal between the gate and drain terminal significantly improve the RF parameters of proposed MODFET.…”
Section: Discussion On Obtained Resultsmentioning
confidence: 91%
“…But the scaling of existing MOSFET technology is restricted by the short channel effects (SCEs) such as drain-induced barrier lowering (DIBL), degradation of the subthreshold slope, hot carrier injection (HCI), and channel length modulation (CLM), etc. MODFET or HEMT is a suitable candidate for overcoming these problems due to the higher mobility of electrons, higher f T , f MAX, and lower values of noise characteristics [1][2][3][4][5].…”
Section: Introductionmentioning
confidence: 99%