Induced defects in iron phosphate nanosheets under different annealing atmospheres for enhanced photo-Fenton type photodecomposition of dye

Sreekanth, T.V.M.; Yoo, Kang; Kim, J.

doi:10.1007/s10854-020-04483-4

Cited by 3 publications

(1 citation statement)

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“…It has been reported that adding a small amount of Cu and Ti to Zn Sn solder alloy reduces the surface tension and improves the wettability of the alloy. 38,39) It has also been reported that adding a small amount of Ce to ZnSnCu solder alloys improves the mechanical properties, 40,41) and the addition of Ge and In reduces the growth rate of intermetallic compounds formed at the joining interface between the Cu substrate and the ZnSn solder alloy. 42) ZnNi solder alloys have been developed for high temperature applications.…”

Section: A D V a N C E V I E Wmentioning

confidence: 97%

Recent Development of Joining and Conductive Materials for Electronic Components

Kobayashi

Ando

2021

Mater. Trans.

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This study introduces research trends in the electronics materials, such as joining materials including high-temperature lead-free solder, sintered materials using metal particles and transient liquid phase (TLP) materials, and conductive materials such as aluminum and copper alloys. These studies include the content of the special issue published in Materials Transactions (Vol. 57, No. 6 and Vol. 60,No. 6) entitled Frontier Researches Related to Interconnection, Packaging and Microjoining Materials and Microprocessing for Such Materials. It also introduces interesting research contents, leading the development of next-generation electronics.

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