Induced electrodeposition of tungsten with nickel from acidic citrate electrolyte

Moussa, Sherif; Ibrahim, Magdy A. M.; Rehim, Sayed S. Abd El

doi:10.1007/s10800-005-9069-8

Cited by 19 publications

(7 citation statements)

References 29 publications

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“…The microstructure of the Ni-W deposits exhibits (111) preferred orientation similar to the fcc (111) phase of Ni. Changing the operating conditions has no significant effect on the XRD patterns [54]; some authors [55,56] have reported the formation of amorphous Ni-W alloys. However, the data shown here cannot be taken as evidence that amorphous alloys have also been deposited.…”

Section: Resultsmentioning

confidence: 99%

Research on Obtaining and Characterizing Ni - W Electroplating Alloys for Micro-Electro Mechanics

Poroch-Seriţan

Creţescu

Gutt

et al. 2022

BULETINUL INSTITUTULUI POLITEHNIC DIN IAȘI. Secția Matematica. Mecanică Teoretică. Fizică

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The present research aimed to electrodeposit and characterize Ni-W alloys for different technological parameters, being an example of “induced co-deposition”, in which a certain metal (for example: Mo, W) can be co-deposited as an alloy, but it cannot be measured in its pure state. The investigated characteristics were the efficiency current, the average thickness, and the structural properties of the obtained deposits. The current efficiency decreases with an increased applied current density, and the tungsten content remains constant at around 11% for different current densities (10 mA·cm−2 and 16 mA·cm−2, respectively). An increase in the temperature of the electrolyte leads to the inclusion of more tungsten. The deposit tungsten content and the current efficiency are directly related to pH. The deposit hardness directly relates to the alloy composition, deposit morphology, and coating thickness. The higher hardness, approximatively 100 HV were measured and the optimal brightness were observed for the alloys obtained at increased current density (i = 16 mA·cm−2, T = 50°C, pH = 8), or to a basic pH (i = 10 mA·cm−2, T = 50°C, pH = 9.23). The scanning electron microscopy (SEM) technique was used to analyze the surface morphology, and energy dispersive spectroscopy (EDS) analysis was carried out to determine the composition of the alloys. The metallic surface brightness (%) was evaluated using the miniature spectrometer, based on the reflection property of the electrodeposited metallic layer, scanning the all-wavelength range between 200-1100 nm.

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Section: Resultsmentioning

confidence: 99%

Research on Obtaining and Characterizing Ni - W Electroplating Alloys for Micro-Electro Mechanics

Poroch-Seriţan

Creţescu

Gutt

et al. 2022

BULETINUL INSTITUTULUI POLITEHNIC DIN IAȘI. Secția Matematica. Mecanică Teoretică. Fizică

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“…The reduction of copper ions, mostly Cu 2+ at low cathodic potentials around −0.5 V in acidic citrate baths was reported recently elsewhere. 21,22 It was also shown that the reduction of Cu-Cit complexes is possible at more negative potentials when the pH of the acidic citrate baths exceeds 3. However, Cu-Cit complexes hardly form in acidic citrate baths of pH below 2.…”

Section: Resultsmentioning

confidence: 99%

Formation of Cu Substrates with W Addition for Vertical Structure Light Emitting Diodes using Electroplating Method

Lee

Kim

2011

J. Electrochem. Soc.

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Pure Cu substrate has been previously electroplated on p-GaN side of vertical structure GaN-based light emitting diode (LED) to mechanically hold thin GaN-based multilayer after removal of a sapphire substrate by laser lift-off process. The ductile Cu substrate needs to be mechanically strengthened to prevent the GaN-based multilayer from being damaged during vertical LED chip fabrication. In this study, the formation of Cu substrate with W addition on Au-seeded LED wafer by electroplating is introduced. W presents as WO 3 in the Cu substrate. W content of W-added Cu deposits was dependent on constant reduction potential in an acidic citrate bath. The reduction potential also influenced directly the electrical resistivity, hardness, and residual stress of W-added Cu substrates. Applying moderate reduction potentials like −1.1 V resulted in 1.5 times larger hardness than that of pure Cu substrate by adding around 1.0 at % W to Cu. Nevertheless, the electrical resistivity of W-added Cu substrate was maintained as low as that of pure Cu substrate. At more positive reduction potentials than −1.1 V, very low residual stress between 4 and 42 MPa was measured. Wafer bowing induced by large residual stress of W-added Cu substrate can cause serious mechanical damage to LED structure.

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“…Interest in the electrodeposition of NiFeW ternary alloys has increased rapidly in recent years because of their excellent properties, such as physical, chemical and mechanical properties. The introduction of tungsten into NiFe alloy coatings improves their microhardness [1][2][3][4][5][6], wear resistance [5][6][7], corrosion resistance [8][9][10] and uniformity organization [11][12][13][14]. There are many studies about the excellent properties of FeW and NiW alloy coatings [15][16][17][18][19].…”

Section: Introductionmentioning

confidence: 99%

Properties of ternary NiFeW alloy coating by jet electrodeposition

Zhao

et al. 2018

Bull Mater Sci

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In this paper, ternary NiFeW alloy coatings were prepared by jet electrodeposition, and the effects of lord salt concentration, jet speed, current density and temperature on the properties of the coatings, including the composition, microhardness, surface morphology, structure and corrosion resistance, were investigated. Results reveal that the deposition rate reaches a maximum value of 27.30 μm h −1 , and the total current efficiency is above 85%. The maximum microhardness is 605 HV, and the wear and corrosion resistance values of the alloy coating are good. Moreover, the ternary NiFeW alloy coating is smooth and bright, and it presents a dense cellular growth. The alloy plating is nanocrystalline and has face-centered cubic structure.

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Induced electrodeposition of tungsten with nickel from acidic citrate electrolyte

Cited by 19 publications

References 29 publications

Research on Obtaining and Characterizing Ni - W Electroplating Alloys for Micro-Electro Mechanics

Research on Obtaining and Characterizing Ni - W Electroplating Alloys for Micro-Electro Mechanics

Formation of Cu Substrates with W Addition for Vertical Structure Light Emitting Diodes using Electroplating Method

Properties of ternary NiFeW alloy coating by jet electrodeposition

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