Abstract:In this article, an efficient die bonding technology based on silver sintering due to induction heating is presented. By using this technology, the heat for the sintering reaction is locally limited to the bonding area and the heating of the entire power module is avoided. Furthermore, the sintering reaction is promoted due to current flow between the silver particles and the sintering time is drastically reduced. Next to the experimental trials presented in this paper, FE-simulation methods were applied in or… Show more
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