Inductively Coupled Connectors and Sockets for Multi-Gb/s Pulse Signaling

Chandrasekar, Karthik; Wilson, John; Erickson, Evan; Feng, Zhiping; Xu, J. Q.; Mick, S.; Franzon, Paul D.

doi:10.1109/tadvp.2008.2005465

Cited by 4 publications

(3 citation statements)

References 12 publications

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“…Numerous types of contact solutions have been developed [2][3][4][5]. One of the most popular technologies utilizes a spring probe as the contact medium between an IC lead frame and a PCB pad [6,7].…”

Section: Introductionmentioning

confidence: 99%

Impedance Matching Capability of Novel Socket Contactor Design Using Variable Open Stubfor Rf Packaging Testing

Wu¹,

Wang²,

Liu³

2011

PIER

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Abstract-In this paper, we will propose a new structure for a socket contactor applied to the lead-frame test board. This structure contains a variable open stub to match the impedance of the package and the load board. Its electrical property is considered superior to a conventional spring probe's, especially when it is applied to a QFP device. We will present its equivalent model and discuss this in detail. Note that the transmission line model we use is at this point a substitute for a physical structure. First, its RLC model will be constructed after we demonstrate its simulation and test data. Finally, we will use the MonteCarlo Method to analyze length inaccuracies in manufacturing and observe how this new structure works.

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Section: Introductionmentioning

confidence: 99%

Impedance Matching Capability of Novel Socket Contactor Design Using Variable Open Stubfor Rf Packaging Testing

Wu¹,

Wang²,

Liu³

2011

PIER

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“…Additionally, inductive coupling has an advantage over capacitive coupling when placed in a transmission line since the frequency-dependent impedance of a series capacitor can lead to significant return loss due to reflections. When a low-loss 1:1 turns ratio transformer is used, the impedance at the input to the transformer is very close to the impedance at the output, thus minimizing reflections [2][3][4].…”

Section: Introductionmentioning

confidence: 99%

“…For level 2 & 3 interconnections, connectors and sockets, multi-Gb/s inductively coupled interconnect has been demonstrated at sub-millimeter pitch ( Fig. 1) [2][3][4]. For all three levels of interconnection, high-speed signaling has been demonstrated using inductors composed of 5 mm or less trace widths and spacings, creating transformers with sub 200 mm diameters and gap spacings of 5 mms or less.…”

Section: Introductionmentioning

confidence: 99%

Multi-bit fractional equalization for multi-Gb/s inductively coupled connectors

Erickson

Wilson

Chandrasekar

et al. 2009

2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems

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Multi-bit fractional equalization at the driver side allows for multi-Gb/s signaling across transformers which suffer from excessive ISI in inductively coupled connectors and backplanes. When an inductively coupled element is place in a transmission line or the gap between inductors in a transformer increases, the amplitude of the coupled pulse is decreased while the natural decay of the pulse is maintained. By removing the effects of the natural decaying tail of the pulse created by coupling an NRZ signal across a transformer, high-speed inductive coupling can be achieved over the larger transformers required by connectors and backplanes. 121 978-1-4244-4448-9/09/$25.00 ©2009 IEEE

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Use of AC Coupled Interconnect in Contactless Packaging

Franzon

2010

Integrated Circuits and Systems

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Inductively Coupled Connectors and Sockets for Multi-Gb/s Pulse Signaling

Cited by 4 publications

References 12 publications

Impedance Matching Capability of Novel Socket Contactor Design Using Variable Open Stubfor Rf Packaging Testing

Impedance Matching Capability of Novel Socket Contactor Design Using Variable Open Stubfor Rf Packaging Testing

Multi-bit fractional equalization for multi-Gb/s inductively coupled connectors

Use of AC Coupled Interconnect in Contactless Packaging

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