2018
DOI: 10.1201/9781420027280
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Inductors and Transformers for Power Electronics

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Cited by 347 publications
(147 citation statements)
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“…On the other hand, in case of power electronic aplications, the operating frequencies are typically high and therefore the effect of the frequency on the leakage inductance has to be accurately modeled as well. The majority of the of the developed frequency dependent leakage models that can be found in the literature [4], [5], [8] are based on the Dowell's frequency dependent leakage inductance model for foil windings [9] and its generalization via the porosity factor.…”
Section: Analytical Leakage Inductance Modelmentioning
confidence: 99%
“…On the other hand, in case of power electronic aplications, the operating frequencies are typically high and therefore the effect of the frequency on the leakage inductance has to be accurately modeled as well. The majority of the of the developed frequency dependent leakage models that can be found in the literature [4], [5], [8] are based on the Dowell's frequency dependent leakage inductance model for foil windings [9] and its generalization via the porosity factor.…”
Section: Analytical Leakage Inductance Modelmentioning
confidence: 99%
“…where: Ra L -Rayleigh number, Pr -Prandtl number, ✏ -Emissivity, -Stefan-Boltzmann constant [28]- [30] zero power injection, thus reducing the admittance matrix of the thermal network, given in Fig. 5b, from (10x10) to (6x6) dimension as shown in (25) and (26).…”
Section: Thermal Modelingmentioning
confidence: 99%
“…This is a reasonable assumption which is very close to reality, due to the high temperature conductance of copper compared to the enamel insulation, which allows to indirectly include the effect of the different cooling conditions of both winding portions, inside and outside of the core window, on the winding hot-spot temperature in a simple manner, by putting in parallel their corresponding heat transfer resistances. Table I: Empirical heat-transfer formulas for conduction, convection and radiation [3,9,10] Conduction…”
Section: Analytical Thermal Modelmentioning
confidence: 99%
“…Decreased cooling surface implies increased thermal resistances towards the ambient (cooling media) which result in higher temperature gradients. Therefore, accurate thermal modeling, that allows for adequate MFT thermal coordination at the design stage, plays an essential role in the search for the overall optimal design [3][4][5][6][7].…”
Section: Introductionmentioning
confidence: 99%