Inertial two- and three-dimensional thin film flow over topography

Abstract

. (2011) 'Inertial two-and three-dimensional thin lm ow over topography.', Chemical engineering and processing : process intensication., 50 (5-6). pp. 537-542. Further information on publisher's website:http://dx.doi.org/10.1016/j.cep.2010.08.008Publisher's copyright statement: NOTICE: this is the author's version of a work that was accepted for publication in Chemical Engineering and Processing: Process Intensication. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reected in this document. Changes may have been made to this work since it was submitted for publication. A denitive version was subsequently published in Chemical Engineering and Processing: Process Intensication, 50, 5-6, May 2011, 10.1016/j.cep.2010.08.008. Additional information:Use policyThe full-text may be used and/or reproduced, and given to third parties in any format or medium, without prior permission or charge, for personal research or study, educational, or not-for-prot purposes provided that:• a full bibliographic reference is made to the original source • a link is made to the metadata record in DRO • the full-text is not changed in any way The full-text must not be sold in any format or medium without the formal permission of the copyright holders.Please consult the full DRO policy for further details. AbstractThe effect of inertia on gravity-driven thin film free-surface flow over substrates containing topography is considered. Flow is modelled using a depth-averaged form of the governing Navier-Stokes equations and the discrete analogue of the coupled equations solved accurately using an efficient full approximation storage (FAS) algorithm and a full multigrid (FMG) technique. The effect of inertia on free-surface disturbances induced by topographic features is illustrated by considering examples of gravity-driven flow over and around peak, trench and occlusion topography.Results are given which demonstrate how increasing Reynolds number can significantly enhance the magnitude of free-surface disturbances induced, a feature which may have important consequences for the wide range of coating processes which aim to maximise free-surface planarity.

Free-surface film flow over topography: Full three-dimensional finite element solutions

“…Figure 6 Re leads to a corresponding increase in the magnitude of the free-surface disturbances experienced, a result consistent with the findings of [65] for flow over a rectangular peak topography, as does an increase in Ca. An interesting observation from both sets of results is that while the DAF predictions are comparatively poor they tend to capture the minimum associated with the downstream trough disturbance more satisfactorily, which is particularly so for the case Re = 10. by film flow over a hemispheroid for which, unlike the cases considered in Figures 6-7, the footprint diameter is large compared to its height (l t = w t = 9.0, s 0 = 0.9); in which case the geometry is expected to conform more suitably to the thin-film geometrical restrictions underpinning the DAF.…”

Stability of Thin Liquid Films Falling Down Isothermal and Nonisothermal Walls

“…The mixing due to the flow field and the wall corrugation is investigated by Heining et al (2012). For the effect of three-dimensional topographical obstacles, see the papers by Veremieiev et al (2010Veremieiev et al ( , 2011Veremieiev et al ( , 2012, Baxter et al (2009), and Blyth and Pozrikidis (2006). Dávalos-Orozco (2007) obtained a Benney-type equation including a function defining the wall deformation.…”

Thin liquid film flow over substrates with two topographical features

“…Despite various studies conducted on the dynamics of thin liquid films on textured substrate and determining the required conditions for successful coating [1][2][3][10][11][12][13]15,17,18], to our knowledge, there is no research on the effect of a groove (or any other topographical texture) on the coating of the subsequent grooves in the flow direction. This is important, as generically the substrates contain many grooves and the required conditions for successful coating of these substrates may differ completely from those with a single groove.…”

“…Understanding the behavior of thin liquid films flowing over topographical structures is essential in qualitative coatings of these substrates and has various applications, including in microelectronics [1][2][3], micro-and nanofluidics [4], displays and sensors [5], and heat-transfer processes [6,7]. Therefore, the subject has been extensively studied both experimentally [5,[8][9][10] and theoretically [2,[11][12][13][14][15].…”