Influence of a Proposed Switching Method on Reliability and Total Harmonic Distortion of the Quasi Z–Source Inverters

Liu, Hang; Subramaniam, Umashankar; Bayrak, Gökay; Moayedi, Hossein; Ghaderi, Davood; Mi̇naz, Mehmet Recep

doi:10.1109/access.2020.2973797

Cited by 12 publications

(9 citation statements)

References 28 publications

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“…Reliability of the QZSI was tested through the mean time to failure (MTTF) analysis with the values of the proposed components, shows a very good result for the long-life of the converter. All experimental and simulations steps have been obtained for the same values of the components to support and confirm the accuracy and correctness of the proposed IMSPW [121].…”

Section: Discussion On Various Modulation Schemes Implemented For the Control Of Z Source Convertersmentioning

confidence: 67%

Review of impedance source power converter for electrical applications

Saravanan

Venkatachalam

Borelessa

et al. 2021

IJAAS

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<p>Power electronic converters have been actively researched and developed over the past decades. There is a growing need for new solutions and topography to increase the reliability and efficiency of alternatives with lower cost, size and weight. Resistor source converter is one of the most important power electronic converters that can be used for AC-DC, AC-AC, DC-DC and DC-DC converters which can be used for various applications such as photovoltaic systems, wind power systems, electricity. Vehicles and fuel cell applications. This article provides a comprehensive overview of Z-source converters and their implementation with new configurations with advanced features, emerging control strategies and applications.</p>

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Section: Discussion On Various Modulation Schemes Implemented For the Control Of Z Source Convertersmentioning

confidence: 67%

Review of impedance source power converter for electrical applications

Saravanan

Venkatachalam

Borelessa

et al. 2021

IJAAS

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“…Different studies show that the void crack formation and expansion in the solder is related to the stress density [25]- [27]. This can be spread out along the solder under vibration and especially when the higher PSD inputs apply to the component, the higher damages can be reported.…”

Section: Combination Of the Rv And Tc Analysis And Resultsmentioning

confidence: 99%

“…This section presents three different steps for vibration, thermal and combination of random vibration and the thermal cycling influences on the solder joints of a DC-DC power boost converter separately. This converter is used widely for power transmission purposes between the power sources and loads like electrical motors or electrical devices that work with DC voltages [24]- [27]. The converter includes the inductor, power switch, input, and output capacitors and connectors for the input and output source and load.…”

Section: Finite Element Methods (Fem) Analysismentioning

confidence: 99%

Investigation of the Thermal Loading and Random Vibration Influences on Fatigue Life of the Solder Joints for a Metal-Oxide-Semiconductor-Field-Effect Transistor in a DC-DC Power Boost Converter

Subramaniam

Yang

et al. 2020

IEEE Access

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This study presents the effects of the vibration and thermal cycling on the fatigue life of a power Metal Oxide Semiconductor Field Effect Transistor (MOSFET) in a power converter circuit. The fatigue mechanism in per loading mode was investigated separately and based on the overlap approach, the synchronous effects were analyzed. The solder creeps' attitudes are depended on the fatigue life for the thermal loops. The success of the deposited strain per thermal loop is in direct relation with the fatigue lifetime. The main source of the stress in the packaging process is the differences between the components' thermal coefficients. To evaluate the effects of the vibration on the fatigue life for the solder layers, the RMS value of the peeling stress was considered. According to the results, the maximum stress and main affected points realized at the corners of the layers. It has been identified that the assembling of the thermal effects and mechanical loads are quickened the failure rate at the solder joints for this device. The Finite Element Method (FEM) is used for the simulation and the results confirm the estimated crack formation places in the layers.INDEX TERMS Solder joints, power MOSFET, fatigue life, finite element method (FEM). I. INTRODUCTIONPower electronics applications and designs widely are expanding based on their inevitable role in Renewable Energy Sources (RESs), industries and aerospace implementations to transmit the power to the load side [1], [2]. In recent years, many comprehensive studies are presented for DC-DC power boost converters that are the main structure between the RESs and load sides. These converters are including the power components like diode and switches. For high frequency and efficient circuits normally power MOSFETs are selected [3]-[6].The associate editor coordinating the review of this manuscript and approving it for publication was Francesco Della Corte .

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“…This topology processes the power twice (two-stage inverters), which are extensively studied and adds many limitations for the component count and the control complexity. During the last decade, many topologies have been introduced using the same approach, such as switched-capacitor based inverters [18][19][20][21][22][23][24], Z source inverters [25][26][27][28][29], and multi-level inverters [30][31][32].…”

Section: Introductionmentioning

confidence: 99%

Single-Stage Three-Phase Grid-Tied Isolated SEPIC-Based Differential Inverter With Improved Control and Selective Harmonic Compensation

2020

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The simple circuit based on DC-DC converters is the main attractive feature of the differential inverter topologies. It has a single-stage and provides modularity and scalability. However, the Negative Sequence Harmonic Component (NSHC) generated at the output terminal may hinder its practical applications. This paper presents a single-stage three-phase isolated differential inverter based on three High-Frequency Link (HFL) transformer-based DC-DC SEPIC converters. The utilized SEPIC converters perform voltage step-up/ down capability with galvanic isolation, which is essential for Renewable Energy Sources (RES). It mitigates the Common-Mode Voltage (CMV) and ElectroMagnetic Interference (EMI). Moreover, this paper proposes a two-loop based d-q synchronous frame grid-current control to mitigate its NSHC. A Type-II compensator and simple NSHC detection circuit are proposed to enhance the inverter's stability and compensate phase-delay of the utilized SEPIC converters. NSHC detection is developed using three cascaded Low Path Filters (LPFs). A 1.6kW inverter prototype was set to validate the performance of the proposed inverter and its control. The control is implemented by the MWPE3 C6713A Expert III DSP board. The proposed topology has a maximum efficiency of 89.744 at 700W output power and 86.4% at full power. The proposed control decreases the NSHC from 40.6 % to 1.614%, which shows its accuracy and precision. Furthermore, THD is reduced from 35.61% to 4.087% and satisfy the recent grid codes (<5%). The simulation results using PSIM software, power loss distribution, and a comparison study of the proposed inverter with similar topologies are also presented.

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Influence of a Proposed Switching Method on Reliability and Total Harmonic Distortion of the Quasi Z–Source Inverters

Cited by 12 publications

References 28 publications

Review of impedance source power converter for electrical applications

Review of impedance source power converter for electrical applications

Investigation of the Thermal Loading and Random Vibration Influences on Fatigue Life of the Solder Joints for a Metal-Oxide-Semiconductor-Field-Effect Transistor in a DC-DC Power Boost Converter

Single-Stage Three-Phase Grid-Tied Isolated SEPIC-Based Differential Inverter With Improved Control and Selective Harmonic Compensation

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