“…For this reason, technological additives such as B, Si, C, Al 2 O 3 , Cu, C, Al and others can be incorporated into the material composition with different purposes. For example, the introduction of B, Si, C reduces the formation of oxides, and at ESD also reduces the erosion resistance of the laminating electrodes [ 22,[35][36][37][38]39 ]. At the same time, the boron serves as a donor for the formation of wear-resistant borides in the layer, the carbon -as an antidecarburization during the transfer process, and for the additional formation of dispersed carbides in the process of forming the coating.…”