2019
DOI: 10.1016/j.jelechem.2018.10.066
|View full text |Cite
|
Sign up to set email alerts
|

Influence of argon ion beam etching and thermal treatment on polycrystalline and single crystal gold electrodes Au(100) and Au(111)

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
2

Citation Types

0
8
0

Year Published

2020
2020
2023
2023

Publication Types

Select...
6

Relationship

0
6

Authors

Journals

citations
Cited by 7 publications
(8 citation statements)
references
References 38 publications
0
8
0
Order By: Relevance
“…Surface oxidation-reduction processes take place between 1.00 V and 1.64 V. There is a pre-oxidation signal between 1.00 V and 1.32 V with a maximum at 1.29 V, followed by a single broad anodic peak with a maximum at 1.41 V. This single anodic signal has been reported previously for highly rough and disordered gold surfaces obtained after etching with Ar + . [29] The pre-oxidation signal has neither been described before for NPG nor for other highly rough surfaces. [25] The somewhat similar surface electrochemistry of NPG (Figure 1) and intentionally roughened surfaces in Refs.…”
Section: Filling Of Cavity and Morphological Characterization Of Npgmentioning
confidence: 99%
See 1 more Smart Citation
“…Surface oxidation-reduction processes take place between 1.00 V and 1.64 V. There is a pre-oxidation signal between 1.00 V and 1.32 V with a maximum at 1.29 V, followed by a single broad anodic peak with a maximum at 1.41 V. This single anodic signal has been reported previously for highly rough and disordered gold surfaces obtained after etching with Ar + . [29] The pre-oxidation signal has neither been described before for NPG nor for other highly rough surfaces. [25] The somewhat similar surface electrochemistry of NPG (Figure 1) and intentionally roughened surfaces in Refs.…”
Section: Filling Of Cavity and Morphological Characterization Of Npgmentioning
confidence: 99%
“…[25] The somewhat similar surface electrochemistry of NPG (Figure 1) and intentionally roughened surfaces in Refs. [25] and [29] is plausible when considering that the highly curved surface of individual ligaments in NPG is dominated by step and kink defects that truncate the metal crystal at the surface. The potential scan is reversed at the so-called Burshtein minimum, [30] at which one oxide monolayer is formed and a further current increase due to water oxidation or oxide multilayer formation has not started yet.…”
Section: Filling Of Cavity and Morphological Characterization Of Npgmentioning
confidence: 99%
“…Furthermore, underpotential deposition (UPD) of Pb 2+ ions was employed to identify the exposed surface. 26 As shown in Fig. 3b, the peaks appearing at 0.24 V and at 0.31 V correspond to the bulk deposition and stripping peak of lead, 27 and Ag powder shows a weak UPD peak around 0.47 V vs. RHE which corresponds to the Pb desorption from the Ag(111) planes.…”
mentioning
confidence: 86%
“…The addition of inert gases makes it possible to increase the intensity of the ion bombardment of the etching bottom and therefore potentially change the shape of Si wires formed during the process. Argon (Ar) is widely used for the ion beam etching process. , There are a few reports where argon was added for RIE of Si through a mask. Chen et al reported about the effect of alternating Ar and SF 6 /C 4 F 8 gas flows in Si plasma etching.…”
Section: Introductionmentioning
confidence: 99%
“…Argon (Ar) is widely used for the ion beam etching process. 18,19 There are a few reports where argon was added for RIE of Si through a mask. Chen et al reported about the effect of alternating Ar and SF 6 /C 4 F 8 gas flows in Si plasma etching.…”
Section: ■ Introductionmentioning
confidence: 99%