Influence of ball milling contamination on properties of sintered AlN substrates

Kim, Shi Yeon; Choi, Dong Kyu; Yeo, Dong Hun; Shin, Hyo‐Sang; Yoon, Ho Gyu

doi:10.1016/j.jeurceramsoc.2020.05.001

Cited by 14 publications

(5 citation statements)

References 31 publications

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“…To completely inhibit hydrolysis of the AlN powder, the additional amount of HPMA was set to 5 wt% in the subsequent study. It is well known that the aqueous tape-casting slurry is usually prepared by a ball milling process, which may possibly destroy the protective layer on the surface of the modified AlN powder and accelerate the hydrolysis degree of the AlN powder [36]. Therefore, the effect of the ball milling process on the hydration properties of the H-AlN powder modified with 5 wt% HPMA was further investigated.…”

Section: Characterization Of Hydrolysis Resistance Of Modified Aln Po...mentioning

confidence: 99%

HPMA modified aluminium nitride powder for aqueous tape casting of AlN ceramic substrates

Meng¹,

Ai²,

Wang³

et al. 2023

Journal of Advanced Ceramics

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Aluminum nitride (AlN) is considered one of the most desirable materials for integrated circuits and electronic packaging substrates. However, raw AlN powder reacts easily with water, forming Al(OH) 3 or AlOOH on the surface and hindering the development of an aqueous tape-casting process for preparing AlN ceramic substrates. In this study, hydrolyzed polymaleic anhydride (HPMA) was used to modify AlN powder, which has good water solubility and dispersibility. The AlN powder was modified with 5 wt% HPMA remained stable in water for at least 90 h under magnetic stirring condition and 24 h under ball milling condition, indicating that HPMA-modified AlN powder has good resistance to hydrolysis. The action mechanism of HPMA is revealed. Firstly, -COOH of the HPMA polymer and the oxide layer on the surface of the AlN powder underwent a dehydration condensation reaction to form a compound. Secondly, long chains of the polymer further coated the surface of the AlN powder, forming an anti-hydration layer with a thickness of about 7.0 nm on the surface of the AlN particles. In addition, AlN green sheets were successfully prepared by aqueous tape casting using the HPMA-modified AlN powder without additional dispersants. Subsequently, AlN ceramic substrates were obtained by sintering at 1750 ℃ for 4 h under an N 2 atmosphere with a pressure of 0.2 MPa. The relative density and thermal conductivity were tested to be 97.3% and 122 W/(m•K), respectively.

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Section: Characterization Of Hydrolysis Resistance Of Modified Aln Po...mentioning

confidence: 99%

HPMA modified aluminium nitride powder for aqueous tape casting of AlN ceramic substrates

Meng¹,

Ai²,

Wang³

et al. 2023

Journal of Advanced Ceramics

View full text Add to dashboard Cite

show abstract

“…AlN exhibits remarkable properties, including corrosion resistance, wear resistance, and exceptional thermal stability. Compared to materials such as Al 2 O 3 (25–40 W/(m K)) [ 24 ] and silicon nitride (Si 3 N 4 , 180 W/(m K)) [ 25 ], AlN has a significantly higher isotropic thermal conductivity range (170–230 W/(m K), with a theoretical upper limit of 320 W/(m K)) [ 26 ]. This level is comparable with the isotopically high thermal conductivity of h-BN (in-plane: 200–280 W/(m K)) [ 27 ], a material characterized by its anisotropic thermal behavior.…”

Section: Introductionmentioning

confidence: 99%

Enhancing the Thermal Conductivity of CNT/AlN/Silicone Rubber Composites by Using CNTs Directly Grown on AlN to Achieve a Reduced Filler Filling Ratio

Matsumoto,

Futaba,

Yamada

et al. 2024

Nanomaterials

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Achieving the thermal conductivity required for efficient heat management in semiconductors and other devices requires the integration of thermally conductive ceramic fillers at concentrations of 60 vol% or higher. However, an increased filler content often negatively affects the mechanical properties of the composite matrix, limiting its practical applicability. To address this issue, in this paper, we present a new strategy to reduce the required ceramic filler content: the use of a thermally conductive ceramic composite filler with carbon nanotubes (CNTs) grown on aluminum nitride (AlN). We combined catalyst coating technology with vacuum filtration to ensure that the catalyst was uniformly applied to micrometer-sized AlN particles, followed by the efficient and uniform synthesis of CNTs using a water-assisted process in a vertical furnace. By carefully controlling the number of vacuum filtration cycles and the growth time of the CNTs, we achieved precise control over the number and length of the CNT layers, thereby adjusting the properties of the composite to the intended specifications. When AlN/CNT hybrid fillers are incorporated into silicone rubber, while maintaining the mechanical properties of rubber, the thermal diffusivity achieved at reduced filler levels exceeds that of composites using AlN-only or simultaneous AlN and CNTs formulations. This demonstrates the critical influence of CNTs on AlN surfaces. Our study represents a significant advancement in the design of thermally conductive materials, with potential implications for a wide range of applications.

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“…AlN exhibits remarkable properties, including corrosion resistance, wear resistance, and exceptional thermal stability. Compared to materials such as Al 2 O 3 (25-40 W/(m K)) [24] and silicon nitride (Si 3 N 4 , 180 W/(m K)) [25], AlN has a significantly higher isotropic thermal conductivity range (170-230 W/(m K), with a theoretical upper limit of 320 W/(m K)) [26]. This level is comparable with the isotopically high thermal conductivity of h-BN (inplane: 200-280 W/(m K)) [27], a material characterized by its anisotropic thermal behavior.…”

Section: Introductionmentioning

confidence: 99%

Enhancing Thermal Conductivity of CNT/AlN/Silicone Rubber Composites through Directly Grown CNTs on AlN for Reduced Filler Filling Ratio

Matsumoto,

Futaba,

Yamada

et al. 2024

Preprint

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Achieving the thermal conductivity required for efficient heat management in semiconductors and other devices requires the integration of thermally conductive ceramic fillers at concentrations of 60 vol% or higher. However, the increased filler content often negatively affects the mechanical properties of the composite matrix, limiting its practical applicability. To address this issue, in this paper, we present a new strategy to reduce the required ceramic filler content: the use of a thermally conductive ceramic composite filler with carbon nanotubes (CNT) grown on aluminum nitride (AlN). We have combined catalyst coating technology with vacuum filtration to ensure that the catalyst is uniformly applied to micrometer-sized AlN particles, followed by efficient and uniform synthesis of CNTs using a water-assisted process in a vertical furnace. By carefully controlling the number of vacuum filtration cycles and the growth time of the CNTs, we demonstrate precise control over the number and length of the CNT layers, thereby adjusting the properties of the composite to the intended specifications. When AlN/CNT hybrid fillers are incorporated into silicone rubber, while maintaining the mechanical properties of rubber, the thermal diffusivity achieved at reduced filler levels exceeds that of composites using AlN-only or simultaneous AlN and CNTs formulations. This demonstrates the critical role of CNTs on AlN surfaces. Our study represents a significant advancement in the design of thermally conductive materials with potential implications for a wide range of applications.

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Influence of ball milling contamination on properties of sintered AlN substrates

Cited by 14 publications

References 31 publications

HPMA modified aluminium nitride powder for aqueous tape casting of AlN ceramic substrates

HPMA modified aluminium nitride powder for aqueous tape casting of AlN ceramic substrates

Enhancing the Thermal Conductivity of CNT/AlN/Silicone Rubber Composites by Using CNTs Directly Grown on AlN to Achieve a Reduced Filler Filling Ratio

Enhancing Thermal Conductivity of CNT/AlN/Silicone Rubber Composites through Directly Grown CNTs on AlN for Reduced Filler Filling Ratio

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