“…Fabrication of ceramics usually requires high sintering temperature (>1000°C), such as the commercial microwave dielectric materials of BaO‐TiO 2 (densification of BaTi 4 O 9 demands a high temperature of 1300°C), Ba(Zn 1/3 B 2/3 )O 3 (sintering temperature of 1500°C‐1650°C for B = Nb, 1500°C for B = Ta), and their suitable temperatures exceed 1300°C, which is very energy‐consuming. For the sake of conserving energy, low‐temperature co‐fired ceramic (LTCC) technology emerges as the time requires, besides, LTCC plays an important role in passive integration, reducing circuit dimension, which can improve the flexibility of the design of circuits, however, LTCC application demands a low sintering temperature for the co‐firing with Ag and Cu electrodes (melting point of Ag, Cu is 961°C and 1083°C, respectively), the materials should also maintain great microwave dielectric properties, such as Bi 2 O 3 ‐TiO 2 ‐V 2 O 5 , Bi‐Li‐Ta, and BiVO 4 ‐LaNbO 4 system studied by Zhou, the sintering temperature of ceramic can be decreased to 800°C and still maintain great properties …”