Influence of Chloride Ion in Acid Tin Methanesulphonate Electrolytes

Effect of additives on electrodeposition of tin and its structural and corrosion behaviour

“…Various organic additives such as surface active agents like cetyl tetraalkyl ammonium bromide, aromatic carbonyl compounds, and amine-aldehyde reaction products, methane sulphonic acid and its derivatives, etc. [10][11][12] are used in plating solutions. Excess organic additives, higher current density and high metal ion concentration in the plating solution may have a bearing on solderability.…”

An Electrochemical Quartz Crystal Nano-Balance Study On Cu-Sn Codeposition From Methane Sulphonic Acid Electrolytes

“…Being an acidic electrolyte it has the added benefit of being compatible with photoresist materials and therefore offers the possibility of being useful for microfabrication. Various researchers have reported on electrodeposition from MSA electrolytes for copper and tin [3,4] and their alloys [5][6][7][8][9][10][11].…”

“…Various additives or complexing agents such as brighteners, antioxidants, and surfactants have been shown to be required for Cu-Sn deposition [2,4,[5][6][7][8][9]. The simplest electrolyte has been shown to require an antioxidant and a fluorosurfactant [5,6].…”

“…Although, the fluorosurfactant, DuPont™ Zonyl® FSN, was initially used to reduce hydrogen evolution [9], more recently, it has been shown to prevent the formation of metal oxides [10]. In addition, the inclusion this additive shifts the metal reduction potential of Cu in the cathodic direction, thereby facilitating the co-deposition of the Cu-Sn alloy [6,11].…”