Influence of Chloride Ions on Quality and Mechanical Properties of Electrodeposited Copper in Copper Electrorefining

Shimokawa, Kimihiro; Tetsuka, Daisuke; Shikada, Kei; Murase, Kuniaki; Sugimura, Hiroyuki; Awakura, Yasuhiro

doi:10.2473/journalofmmij.129.72

Cited by 4 publications

(2 citation statements)

References 15 publications

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“…In the electrorefining of Cu, smoothing the deposits at the cathode surface is required because the current efficiency for Cu deposition significantly decreases owing to the contact between the cathode and anode when the protrusion is formed at the cathode. Gelatin 13) and thiourea are added to electrolytic solutions to smooth the cathode surface and prevent impurities from codepositing, and chloride ions are added to facilitate the formation of slime resulting from the anode. When gelatin, thiourea, and chloride ions are all added to an electrolyte, the cathode potential shifts toward the less noble direction, causing the crystal grains of the deposited Cu to become fine.…”

Section: Introductionmentioning

confidence: 99%

Synergistic Effects of Additives on the Deposition Behavior, Throwing Power and Surface Roughness of Cu Obtained from Electrorefining Solution

2020

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To elucidate the synergistic effects of gelatin, thiourea, and chloride ions on the deposition behavior, throwing power, and surface roughness of Cu obtained from electrorefining solutions, Cu electrodeposition was performed at a current density of 200 A•m ¹2 and a charge of 5 © 10 5 C•m ¹2 in an unagitated sulfate solution containing 0.708 and 2.04 mol•dm ¹3 of CuSO 4 and H 2 SO 4 , respectively, at a temperature of 60°C. Gelatin and chloride ions have synergistic effects on the polarization for Cu deposition, and the polarization effect increased with each concentration. Thiourea was found to promote Cu deposition and decrease the polarization effects of gelatin and chloride ions as its concentration in the solution were increased. The throwing power and surface roughness of the deposited Cu changed depending on the concentration of the three additives. The throwing power of Cu significantly worsened with increasing concentrations of thiourea and its surface roughness decreased with decreasing concentrations of chloride ions. With increasing concentrations of gelatin, the throwing power of Cu improved and its surface roughness decreased. The correlation between the throwing power and polarization resistance of Cu deposition was observed, and the throwing power of Cu improved as its polarization resistance increased. Since the surface roughness of deposited Cu is a result of its micro deposition properties, it does not depend on polarization resistance alone. Thiourea appeared to promote Cu deposition at the concavity, and therefore, it decreased the surface roughness of the deposited copper.

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Section: Introductionmentioning

confidence: 99%

Synergistic Effects of Additives on the Deposition Behavior, Throwing Power and Surface Roughness of Cu Obtained from Electrorefining Solution

2020

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“…When gelatin, thiourea, and chloride ions are all added to the electrolyte, the cathode potential shifts toward the less noble direction, causing the crystal grains of the deposited Cu to become ner. [4][5][6][7][8] The effects of straightchain polymer additives 9,10) (e.g., gelatin and polyethylene glycol), thiourea 11,12) and chloride ions [13][14][15] along with the synergistic effects 16) of polymer additives and chloride ions on Cu electrore ning were reported. However, there are many ambiguities regarding the synergistic effects of gelatin, thiourea, and chloride ions on the surface roughness and throwing power of deposited Cu.…”

Section: Introductionmentioning

confidence: 99%

Effects of Additives on the Surface Roughness and Throwing Power of Copper Deposited from Electrorefining Solutions

et al. 2017

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To elucidate the synergistic effects of gelatin, thiourea, and chloride ions on the surface roughness, throwing power, and polarization curves for Cu deposition from electrore ning solutions, Cu electrodeposition was performed at a current density of 200 A•m −2 and a charge of 5 × 10 5 C•m −2 in an unagitated sulfate solution containing 0.708 mol•dm −3 of CuSO 4 and 2.04 mol•dm −3 of H 2 SO 4 at a temperature of 60 C. In solutions containing all three additives (gelatin, thiourea, and chloride ions), the surface roughness of deposited Cu decreased with increasing thiourea and gelatin concentrations and decreasing chloride ions concentration. On the other hand, the throwing power of deposited Cu improved with decreasing thiourea concentration and increasing gelatin concentration in solutions containing all three additives. The throwing power of deposited Cu was signi cantly improved in solutions containing both gelatin and chloride ions. The polarization resistance dE/di for Cu deposition increased in solutions containing both gelatin and chloride ions, resulting in an improvement in the throwing power of Cu deposition. As small amounts of thiourea have a depolarization effect on Cu deposition, a smoothing effect is expected to result from the promotion of deposition at recesses.

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Synergistic Effect of Additives on the Surface Roughness and Throwing Power of Copper Deposited from Electrorefining Solution

Suzuki

Oue

Kobayashi

et al. 2017

J. Japan Inst. Metals and Materials

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To elucidate the synergistic effect of gelatin, thiourea and chloride ions on the surface roughness, throwing power and polarization curves for Cu deposition from electrorefining solution, Cu electrodeposition was performed at a current density of 200 A·m -2 and 5×105 C·m -2 of charge in an unagitated sulfate solution containing 0.708 mol・dm -3 of CuSO 4 and 2.04 mol・dm -3 of H 2 SO 4 at a temperature of 60℃. In solutions containing three kinds of additives such as gelatin, thiourea and chloride ions, the surface roughness of deposited Cu decreased with increasing the concentration of thiouea and gelatin and decreasing the chloride ions. On the other hand, the throwing power of deposited Cu was improved with decrease in thiourea and increase in gelatin in solutions containing three kinds of additives. The throwing power of deposited Cu was significantly improved in solution containing both gelatin and chloride ions. The polarization resistance dE/di for Cu deposition increased in solution containing both gelatin and chloride ions, which resulting in improvement of throwing power of Cu deposition. As small amounts of thiourea have a depolarization effect on Cu deposition, a leveling effect is expected owing to the promotion of deposition at recesses.

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Influence of Chloride Ions on Quality and Mechanical Properties of Electrodeposited Copper in Copper Electrorefining

Cited by 4 publications

References 15 publications

Synergistic Effects of Additives on the Deposition Behavior, Throwing Power and Surface Roughness of Cu Obtained from Electrorefining Solution

Synergistic Effects of Additives on the Deposition Behavior, Throwing Power and Surface Roughness of Cu Obtained from Electrorefining Solution

Effects of Additives on the Surface Roughness and Throwing Power of Copper Deposited from Electrorefining Solutions

Synergistic Effect of Additives on the Surface Roughness and Throwing Power of Copper Deposited from Electrorefining Solution

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