Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration

Qiu, Hongyu; Han, Xu; Zhang, Chuge; Hu, Xiaowu; Jiang, Xiongxin; Li, Qinglin

doi:10.1007/s10854-021-06256-z

Cited by 2 publications

(2 citation statements)

References 37 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The compound generated by Co in SnBi solder is (Cu,Co) 6 Sn 5 . Unlike Cu 6 Sn 5 which aligns with the direction of the applied current, (Cu,Co) 6 Sn 5 and the current are at a certain angle, improving the mechanical properties of the solder joint [ 97 ]. In the interfacial reaction, the binding energy between Co and Sn is greater than that between Cu and Sn.…”

Section: Methods and Measures Of Electromigration Mitigation For Snbi...mentioning

confidence: 99%

“… The cross-sectional SEM images and EPMA analysis of Cu-xCo/SAC305/Cu-xCo (x = 0, 30 and 50 wt.%) joints under the conditions of 260 °C, 2.89 × 10 2 A/cm 2 for 10 h, ( a ) Cu/SAC305; ( b ) Cu-30Co/SAC305; ( c ) Cu-50Co/SAC305 and IMC layer thicknesses; ( d ) Sn–Bi; and ( e ) Sn–Bi–0.5Co as a function of reaction time at various temperatures [ 96 , 97 ]. …”

Section: Figurementioning

confidence: 99%

See 1 more Smart Citation

Research Overview on the Electromigration Reliability of SnBi Solder Alloy

Li,

Guo,

et al. 2024

Materials

View full text Add to dashboard Cite

Due to the continuous miniaturization and high current-carrying demands in the field of integrated circuits, as well as the desire to save space and improve computational capabilities, there is a constant drive to reduce the size of integrated circuits. However, highly integrated circuits also bring about challenges such as high current density and excessive Joule heating, leading to a series of reliability issues caused by electromigration. Therefore, the service reliability of integrated circuits has always been a concern. Sn-based solders are widely recognized in the industry due to their availability, minimal technical issues during operation, and good compatibility with traditional solders. However, solders that are mostly Sn-based, such as SAC305 and SnZn, have a high melting point for sophisticated electronic circuits. When Bi is added, the melting point of the solder decreases but may also lead to problems related to electromigration reliability. This article reviews the general principles of electromigration in SnBi solder joints on Cu substrates with current flow, as well as the phenomena of whisker formation, voids/cracks, phase separation, and resistance increase caused by atomic migration due to electromigration. Furthermore, it explores methods to enhance the reliability of solder joint by additives including Fe, Ni, Ag, Zn, Co, RA (rare earth element), GNSs (graphene nanosheets), FNS (Fullerene) and Al2O3. Additionally, modifying the crystal orientation within the solder joint or introducing stress to the joint can also improve its reliability to some extent without changing the composition conditions. The corresponding mechanisms of reliability enhancement are also compared and discussed among the literature.

show abstract

Section: Methods and Measures Of Electromigration Mitigation For Snbi...mentioning

confidence: 99%