2014
DOI: 10.1246/bcsj.20130282
|View full text |Cite
|
Sign up to set email alerts
|

Influence of Complexing Agents on Adhesion Strength of Electroless Nickel–Phosphorus Plating to Silicon Nitride–Aluminum–Polyimide Mixed Substrates

Abstract: The adhesion force of electroless nickel–phosphorus (Ni–P) platings prepared on silicon nitride (SiN), aluminum (Al), and polyimide (PI) substrates using complexing agents of glycine, succinic acid, succinic acid with glycine, and succinic acid with malic acid was demonstrated for the application to wafer-level packaging in large-scale integrated circuits. The adhesion strength of Ni–P platings was investigated by the tape-peeling test and the universal mechanical strength tester. As results, no peeling of Ni–… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

0
1
0

Year Published

2019
2019
2019
2019

Publication Types

Select...
1

Relationship

0
1

Authors

Journals

citations
Cited by 1 publication
(1 citation statement)
references
References 12 publications
0
1
0
Order By: Relevance
“…A dry process, such as metal sputtering, combining with a wet process, such as electroless deposition and then electroplating, is the most popular process now, because the adhesion strength between the metal layer and the PI film is critical. 9,[22][23][24][25][26][27][28][29] Various surface modification approaches of PI were proposed, including dry [29][30][31][32][33][34][35][36][37][38][39][40] and wet 1,4,15,30,36,[40][41][42][43][44][45][46][47][48][49] processes. However, when one considers the process, tools cost, through put, reliability and so on together, it seems difficult to obtain an overall perfect process to achieve the PI surface metallization with a layer of thin copper foil without roughness in between because of the requirement of fine lines and high frequency transmission.…”
mentioning
confidence: 99%
“…A dry process, such as metal sputtering, combining with a wet process, such as electroless deposition and then electroplating, is the most popular process now, because the adhesion strength between the metal layer and the PI film is critical. 9,[22][23][24][25][26][27][28][29] Various surface modification approaches of PI were proposed, including dry [29][30][31][32][33][34][35][36][37][38][39][40] and wet 1,4,15,30,36,[40][41][42][43][44][45][46][47][48][49] processes. However, when one considers the process, tools cost, through put, reliability and so on together, it seems difficult to obtain an overall perfect process to achieve the PI surface metallization with a layer of thin copper foil without roughness in between because of the requirement of fine lines and high frequency transmission.…”
mentioning
confidence: 99%