Influence of crystalline structure on diffusion barrier property of electroless Ni–Fe–P coatings in Zn–Al solder interconnects

Liu, Li; Zhang, Han; Zheng, Hao; Peng, Juan; Gong, Pan; Wang, Xuanguo; Chen, Zhiwen; Cao, Xueqiang

doi:10.1016/j.jallcom.2019.06.384

Cited by 11 publications

(2 citation statements)

References 30 publications

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“…Ni-P plating performs well in terms of wear resistance at high temperatures [7]. The incorporation of elements such as W, Sn, Co, Mo, Fe, or Cu to create quaternary or ternary alloys further enhances their tribological behavior, corrosion resistance, and thermal stability [8][9][10][11]. For instance, Ni-Mo-P plating is often stronger and more corrosion-resistant than Ni-P plating [12].…”

Section: Introductionmentioning

confidence: 99%

Tribological behavior of autocatalytic Ni-P based duplex coatings

Biswas,

Das,

Sahoo

2024

Phys. Scr.

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The present research evaluates the tribological performance of different Ni-P based duplex autocatalytic coatings (electroless coatings). The study investigates coatings including Ni-P/Ni-W-P, Ni-P/Ni-Mo-P, and Ni-P/Ni-Cu-P, examining various factors such as heat treatment conditions, sample composition, and their influence on the coatings' performance. The phase structure of the coatings is influenced by heat treatment parameters viz. temperature and duration as well as phosphorus content. Notably, at temperatures above 400°C, all duplex coatings form a robust nickel phosphide phase, enhancing hardness and wear resistance which is almost double of that in as-deposited state in some cases. When subjected to a temperature of 400°C for duration of 1 hour, the Ni-P/Ni-W-P coating displays the highest microhardness (1440 HV 0.1) and the lowest wear rate (10.62×10-5. mm3. N-1. m-1) among all the duplex coatings. In all three duplex systems, the wear typically involves a combination of abrasive and adhesive mechanisms. Among the as-deposited coatings, the Ni-P/Ni-Cu-P demonstrates higher corrosion potential (Ecorr -302 mV) and lower corrosion current (icorr 1.83×10-5 mA/cm2) which imply superior corrosion resistance compared to the other duplex coatings. In the heat-treated state, the Ni-P/Ni-Mo-P duplex coating generally exhibits better corrosion resistance when compared to the other two types of duplex coatings. 

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Section: Introductionmentioning

confidence: 99%

Tribological behavior of autocatalytic Ni-P based duplex coatings

Biswas,

Das,

Sahoo

2024

Phys. Scr.

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“…However, these solders have a melting point of around 220°C, making it difficult to take advantage of the characteristics of SiC power semiconductors, which can operate at high temperatures of 200°C or higher. Zn-Al solder is currently under consideration as a high-temperature solder material for next-generation devices [6,7]. Zn-Al alloys are reasonable candidates as hightemperature solder materials because they have a melting point above 350°C, excellent thermal and electrical conductivity, and good mechanical properties [8,9].…”

Section: Introductionmentioning

confidence: 99%

Fabrication of High-Temperature Solder by Zn Plating Films Containing Al Particles

Kobayashi,

Abiko,

Shohji

2023

KEM

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This study investigated the microstructure and melting point of the Zn–Al composite electroplating film. The cross-sectional microstructure and shear strength of the joints made from the plating films were also evaluated. Zn and Al were confirmed in the plating films from initial microstructure observation. The plating film prepared by a plating bath without cationic surfactant melted near the melting point of Zn and the eutectic point of Zn–Al. When jointed at a joining temperature of 443°C, joining pressure of 5 MPa, and holding time of 5 min, multiple intermetallic compounds, Zn–Al eutectic layers, and unreacted Al particles were observed in the joint layer. From quantitative analysis, the multiple intermetallic compounds were estimated to be Zn–Ni and Zn–Al–Ni intermetallic compounds. The shear strength of the joints increased with increasing joining pressure but was lower than that of Sn–5Sb solder. Fracture after the shear test was observed at the interface between unreacted Al particles and Zn–Al–Ni intermetallic compounds, and inside unreacted Al particles.

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Using RSM optimization to fabricate Ni–Fe–P ternary alloy electroless coating and explore its corrosion properties

Zhang

Bai

et al. 2021

J Mater Sci: Mater Electron

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Influence of crystalline structure on diffusion barrier property of electroless Ni–Fe–P coatings in Zn–Al solder interconnects

Cited by 11 publications

References 30 publications

Tribological behavior of autocatalytic Ni-P based duplex coatings

Tribological behavior of autocatalytic Ni-P based duplex coatings

Fabrication of High-Temperature Solder by Zn Plating Films Containing Al Particles

Using RSM optimization to fabricate Ni–Fe–P ternary alloy electroless coating and explore its corrosion properties

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