Influence of crystallographic orientation and layer thickness on fracture behavior of Ni/Ni3Al multilayered thin films

Banerjee, Rajarshi; Fain, Jacques; Anderson, Peter M.; Fraser, Hamish L.

doi:10.1016/s1359-6462(01)00966-6

Cited by 11 publications

(3 citation statements)

References 4 publications

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“…Solubility limits of aluminium in nickel determined from first principles calculations coupled with a mean field approximation or a kinetic Monte Carlo method and compared to the data of Ohtani et al [18]. [35][36][37][38]. If we assume that ε…”

Section: Temperature (K)mentioning

confidence: 99%

From the interface energy to the solubility limit of aluminium in nickel from first-principles and Kinetic Monte Carlo calculations

Hin

Lépinoux

Neaton

et al. 2011

Materials Science and Engineering: B

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Section: Temperature (K)mentioning

confidence: 99%

From the interface energy to the solubility limit of aluminium in nickel from first-principles and Kinetic Monte Carlo calculations

Hin

Lépinoux

Neaton

et al. 2011

Materials Science and Engineering: B

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“…17 Macroscopically, (111)-textured samples with in-plane dimensions of approximately 0.5 cm by 4 cm frequently contained numerous, large, throughthickness cracks that made them unsuitable for tensile testing, while (001)-textured samples could be reliably produced and tested. 17 Macroscopically, (111)-textured samples with in-plane dimensions of approximately 0.5 cm by 4 cm frequently contained numerous, large, throughthickness cracks that made them unsuitable for tensile testing, while (001)-textured samples could be reliably produced and tested.…”

Section: Effect Of Layer Thickness On Stress State In (001) Ni/ni mentioning

confidence: 99%

Processing and microstructural characterization of sputter-deposited Ni/Ni₃Al multilayered thin films

et al. 2003

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The crystallographic texture, orientation relationships, coherency stress, and thermal stability of sputter-deposited Ni/Ni 3 Al multilayered thin films were studied as a function of bilayer period (⌳) as well as processing parameters such as substrate type, deposition temperature, and prebake conditions. Deposition onto oxidized Si or single-crystal Cu(001), NaCl(001), or KBr(001) substrates near room temperature produces multilayers with a [111] crystallographic texture along the Ni/Ni 3 Al interface normal and a disordered face-centered cubic structure for the Ni 3 Al phase. In contrast, deposition at 673 K onto NaCl(001) or KBr(001) substrates that are prebaked in vacuum at 693 K produces a chemically ordered L1 2 structure for the Ni 3 Al phase and (001) epitaxial growth. X-ray diffraction measurements of (001) multilayers with equal volume fraction of Ni and Ni 3 Al reveals a transition from a nearly incoherent state at ⌳ ‫ס‬ 240 nm to a semicoherent one at ⌳ ‫ס‬ 40 nm. Remarkably, (001) multilayers were observed to solutionize at 1373 K, which is approximately 100 K below that predicted by the Ni-Al phase diagram.

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“…The experimental data clearly shows that for bilayer thickness below ∼230 nm, the tensile constitutive response is essentially linear up to fracture, with a large scatter in ultimate tensile strength. Scanning electron microscopy (SEM) of fractured Ni(Al)/Ni 3 Al multilayer thin films indicates that such macroscopically brittle fracture may actually consist of narrow shear bands through the film thickness, 5 suggesting that plastic deformation can be quite localized near the fracture plane. Novel transmission electron microscopy (TEM) studies by Foecke and Kramer 6 document a crack tip plastic zone in Cu/Ni multilayer thin films that is highly localized along the fracture path and orders of magnitude smaller than the plastic zone in the adjoining Cu substrate.…”

Section: Introductionmentioning

confidence: 99%

Correlation of stress state and nanohardness via heat treatment of nickel-aluminide multilayer thin films

2004

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Heat treatment of ␥-Ni(Al)/␥Ј-Ni 3 Al multilayer thin films demonstrates that multilayer hardness correlates with the magnitude of biaxial stress in alternating layers. Films with a columnar grain morphology and (001) texture were fabricated over a range of volume fraction and bilayer thickness via direct current magnetron sputtering onto NaCl (001) substrates at 623 K. The films were removed from substrates, heat-treated at either 673 K or 1073 K in argon, and then mounted for nanoindentation and x-ray diffraction. The biaxial stress state in each phase was furnished from x-ray diffraction measurement of (002) interplanar spacings. The 673 K treatment increases the magnitude of alternating biaxial stress state by 70 to 100% and increases hardness by 25 to 100%, depending on bilayer thickness. In contrast, the 1073 K heat treatment decreases the stress magnitude by 70% and decreases hardness by 50%. The results suggest that the yield strength of these thin films is controlled, in part, by the magnitude of internal stress. Further, thermal treatments are demonstrated to be an effective means to manipulate internal stress.

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Influence of crystallographic orientation and layer thickness on fracture behavior of Ni/Ni3Al multilayered thin films

Cited by 11 publications

References 4 publications

From the interface energy to the solubility limit of aluminium in nickel from first-principles and Kinetic Monte Carlo calculations

From the interface energy to the solubility limit of aluminium in nickel from first-principles and Kinetic Monte Carlo calculations

Processing and microstructural characterization of sputter-deposited Ni/Ni₃Al multilayered thin films

Correlation of stress state and nanohardness via heat treatment of nickel-aluminide multilayer thin films

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Influence of crystallographic orientation and layer thickness on fracture behavior of Ni/Ni3Al multilayered thin films

Cited by 11 publications

References 4 publications

From the interface energy to the solubility limit of aluminium in nickel from first-principles and Kinetic Monte Carlo calculations

From the interface energy to the solubility limit of aluminium in nickel from first-principles and Kinetic Monte Carlo calculations

Processing and microstructural characterization of sputter-deposited Ni/Ni3Al multilayered thin films

Correlation of stress state and nanohardness via heat treatment of nickel-aluminide multilayer thin films

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Processing and microstructural characterization of sputter-deposited Ni/Ni₃Al multilayered thin films